Abstract: A new asynchronous approach used to quickly and dynamically switch input port connections to output port connections and to resolve contention. The switch is self-routing in two cycle times at the same high speed serial rate that data is transferred through the switch. The normal mode of the switch requires absolutely no synchronization amongst any of the input and output ports which interface to the switch. The switch is void of centrally controlled clocking and any data buffering. Data traverses the switch only encountering three gate delays—on-chip receiver, mux, and off-chip driver. Contention is detected and resolved on chip, and yet the logic implementation is extremely simple and low in gate count, so the switch design is never gate limited. The protocol requires several parallel data lines plus two or three control lines.

Abstract: An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

Abstract: An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

Abstract: A processor clock (302) is momentarily synchronized to a subsystem clock (307) during transfers of data between a processor (301) and a subsystem (305). After the completion of the data transfer, synchronization is disabled and the processor clock runs asynchronously at its own internal frequency, which is higher than the subsystem clock frequency. In one embodiment, the processor clock uses a free running ring oscillator (401) that is constructed on the same integrated circuit chip as the processor. Changes in temperature and power supply voltage not only cause changes in the maximum operating speed of the processor, but they also cause corresponding changes in the frequency of the processor clock. Thus, the frequency of the processor clock tracks changes in the maximum operating speed of the processor caused by temperature and power supply variations.

Abstract: An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

Abstract: A trackball pointing device has a housing of a size that can be readily held in the hand of a user. The housing includes a top wall upon which are mounted a trackball and buttons for manipulation by a user's thumb. A cable passes emerges from the bottom wall of the housing. The bottom wall includes a plurality of channels extending in different directions from where the cable passes through the housing wall. Each channel is recessed and has strain relief tabs therein so that the cable can be placed in one of the channels and releasably held in place by the tabs. A user can locate or place the cable in the one of the channels most suitable to the user.