Abstract: A security wrapper for an electronic assembly and methods for forming such a wrapper are provided. A first wrap layer and/or a second wrap layer may be made from a curable adhesive material. A flexible layer is interposed between the first and second wrap layers, which in combination constitute a pre-formed wrapper in an uncured condition. The pre-formed wrapper may be mounted onto an electronic assembly including circuit components having respective three-dimensional profiles which can vary over a surface of the electronic assembly. The pre-formed wrapper may be subjected to a curing process so that in a cured condition conformable adherence is provided with respect to the circuit components. This arrangement provides a thermal coupling effective to dissipate heat produced by such circuit components and further results in a low-profile for the assembly of the wrapper and electronic assembly.