Abstract: A system for utilizing more than one communication protocol on a single mass flow controller (MFC) device. Communication protocols include, but are not limited to, DeviceNet, RS-485, and analog. A D-Subminiature connector (D-Sub) of the MFC has a pin configuration system that is compatible between RS-485 and analog. In addition, a different connector plug is used for DeviceNet on the same MFC, eliminating the need for compatibility of pins with other communication protocols. Together, these above-mentioned configuration systems allow one MFC device to choose between more than one communication protocol.

Abstract: A wafer support platen heating system for low pressure chemical vapor deposition of apparatus includes multiple resistance heaters for individual heating of multiple portions of the platen to provide a predetermined uniform or non-uniform temperature gradient/profile across the platen. The multiple graphite resistance heaters of the preferred embodiment include a spiral shaped main resistance heater and two single turn edge loss graphite resistance heaters located within the inner diameter and along the periphery of the outer diameter respectively of the main spiral shaped resistance heater.