Abstract: A test head 90 having a plurality of contact pairs 81 is formed in a simple monolithic manner. A plurality of first conductors 74 are aligned in a first row and, spaced therefrom, a plurality of second conductors 80 are aligned in a second row. Each conductor has a circuit end and a contact end and each first conductor 74 registers with a mating second conductor 80 to form a plurality of contact pairs 81 at the contact ends.A common base insulator 88 is formed transversely of the conductors 74 and 80 at the circuit ends to maintain conductor spacing in an electrically insulated manner. A common bar insulator 86 is formed transversely of the second conductors 80 to maintain the contact spacing within the pairs 81 when the conductors are flexed toward a device 27 to be tested.In a method of making a test head 90, the conductors are made in patterns 56 from sheet 55 having a substantially uniform metallurgical composition and each pattern 56 includes a member 72 connected to the circuit ends of the conductors.

Abstract: Compliant bonding of successive beam-lead semiconductor devices to successive metallic patterns on substrates is accomplished with a bonding apparatus that uses an indexable compliant member. A bonding head of the apparatus is provided with a single movable tip which disengages from the compliant member during indexing of the member. The movable tip engages with a portion of the compliant member that is suspended between two drive sprockets when it is desired to perform a bonding operation. The engagement of the tip with the compliant member produces tension in the member. The tension results in a precise and flat configuration within the engaged portion of the member. The flat configuration enhances accurate alignment of workpieces to the compliant member.A toggle linkage is described as a desirable system for moving the bonding tip with respect to the head.