Abstract: A structure for making a sealed electrical connection through a barrier is disclosed. The structure comprises a feed-through board that is sealed in an aperture in the barrier. A conductive rod is disposed within a bore formed in the board. Inner and outer conductors are electrically connected to the conductive rod by means of connecting structures formed in the respective ends thereof. A plurality of layers of insulative materials are formed about the inner and outer conductors and the conductive rod so as to electrically insulate the conductors and the conductive rod, to form a structurally sound point of connection through the barrier, and to seal the bore through which the conductive rod is passed. A method for making a sealed electrical connection through a barrier is also disclosed.