Abstract: A clad metal composite produced according to a method for edge-to-edge cladding of two or more different metals (such as aluminum and copper). The metals are joined next to each other to form an edge-to-edge or side-by-side clad bimetal. In one embodiment, nine metal strips are used to create the desired clad metal composite. The design includes strips of metal that have industry standard cut edges (such as, slit-cut edges). In one embodiment, the clad metal composite includes multiple layers of metals positioned edge-to-edge. In one embodiment, the method of making an edge-to-edge composite includes providing multiple layers of metal made of separate strips, aligning the strips in the multiple layers with one another so that edges of the strips of the multiple layers do not align with one another, and then bonding the layers and strips to one another.

Abstract: A clad metal composite produced according to a method for edge-to-edge cladding of two or more different metals (such as aluminum and copper). The metals are joined next to each other to form an edge-to-edge or side-by-side clad bimetal. In one embodiment, nine metal strips are used to create the desired clad metal composite. The design includes strips of metal that have industry standard cut edges (such as, slit-cut edges). The clad metal composite may include multiple layers of metals positioned edge-to-edge.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: Apparatus and method for making a heat sink assembly. The apparatus includes a first clip configured to be urgingly attached to a heat producing device, the first clip having a first edge, a second edge, a third edge, and a fourth edge. The apparatus further includes a heat sink configured to be attached to the first clip, and a second clip configured to be attached to the first clip, the second clip being sized to accommodate a portion of the heat sink, and the second clip urging the heat sink towards the heat producing device. Methods to make the foregoing apparatus are also described.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: Methods of and devices for continuously casting molten material onto one or more surfaces of a moving substrate to provide one or more profiles on one or more surfaces are disclosed in the present invention. In a preferred embodiment, the casting method includes providing a substrate, heated reservoir of a molten material, and a casting die; moving the substrate past the casting die into which the molten material is introduced; containing the molten material against the one or more surfaces of the moving substrate; heating the casting die to prevent the molten material from solidifying prematurely; and cooling the molten material to solidify the molten material to provide one or more profiles on the one or more surfaces of the moving substrate and to bond the solidified profile(s) to the one or more surfaces.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: A multi-layer metal composite for microwave tubing and the like, which comprises a tubular shaped copper alloy base metal (e.g., brass or phosphorus bronze) lined with silver. A relatively thin interliner layer of a grain refiner containing copper alloy (e.g., copper-zirconium alloy (C15100), tellurium-copper (C14530), cadmium-copper (C14300), manganese-copper (C15500), alumina-copper (C157XX), beryllium-copper (C17410), or the like) is provided between the base metal and the silver, for limiting diffusion of impurities from the base metal into the silver coating and for maintaining a smooth, relatively constant cross section of silver.

Abstract: A heat exchanger assembly, having a first oxygen-rich copper base layer joined to a first layer of beryllium oxide, a first oxygen-rich copper layer joined to the first beryllium oxide layer, a second beryllium oxide layer joined to the first oxygen-rich copper layer, a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer, a second oxygen-rich copper base layer joined to the second beryllium oxide layer, and a heat exchanger structure direct bonded to the second base layer. The structure has a plurality of oxygen-rich copper fins stacked upon one another, each fin having a channel at a selected location therein. The material to material interfaces between adjacent stacked fins are joined to one another by direct bonding so as to form a solidified block structure. Each of the channels form a cooling chamber for receiving a fluid flow.

Abstract: A metal system which comprises a titanium base metal strip, at least one surface having platinum stripes thereon. As a multilayer laminate, there is provided a titanium base metal strip sandwiched between first and second copper layers. At least one surface of the first copper layer facing the titanium has platinum stripes. A method of producing the metal system and laminate, includes the step of initially cleaning bonding surfaces of a first copper strip. During a first processing phase, platinum stripes are cold roll bonded to at least one of the first copper strip surfaces. Excess material is skived from the striped copper strip, then the strip is cleaned. Upon a second process phase, bonding surfaces of the striped first copper layer, a second copper strip layer and a titanium base metal strip are cleaned. Next, the striped first copper layer is placed on the titanium base metal strip, the platinum stripes facing the titanium, and the titanium base metal strip is placed upon the second copper layer.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: A controlled oxygen content copper clad laminate product. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: A leadframe for use in mounting and interconnecting an integrated circuit. A first or base metal layer of the leadframe comprises at least one of brass or other copper alloy. A second, conducting layer atop the base layer comprises at least one of aluminum or an aluminum alloy. A third, upper layer on the second layer comprises at least one of copper or a copper alloy. The first, second and third layers are formed into a multilayer clad strip, a portion of at least the third layer being selectively removed to expose a selected pattern of the second layer.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal to conform to the desired application of the leadframe. The clad strip may be formed of a base layer of copper alloy, a conducting layer of aluminum or aluminum alloy, and an upper layer of copper or a copper alloy. A layer of tin or lead-tin alloy may be plated onto the upper layer.