Patents by Inventor Joseph Pankow

Joseph Pankow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Covers for ultrasound probe
    Patent number: 11957511
    Abstract: A cover for an ultrasound scanning assembly is provided, wherein the cover exerts compressive force on the patient during use. The cover includes an outer frame and a nonporous or porous film extending across the outer frame. The outer frame is formed of a soft touch material.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: April 16, 2024
    Assignee: CIVCO MEDICAL INSTRUMENTS CO., INC.
    Inventors: Craig Joseph Cermak, Justin Paul Reynolds, Geoffrey Scott Wagner, Hannah Marie Pankow, Alexas Marin Swartz
  • Method of fabricating a circuit board
    Patent number: 9003652
    Abstract: The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: April 14, 2015
    Assignee: Dell Products L.P.
    Inventors: Joel R. Goergen, Greg Hunt, Peter Tomaszewski, Joseph Pankow, Michael Laudon
  • IMPEDANCE TUNING FOR CIRCUIT BOARD SIGNAL PATH SURFACE PAD STRUCTURES
    Publication number: 20120144665
    Abstract: The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
    Type: Application
    Filed: February 20, 2012
    Publication date: June 14, 2012
    Applicant: Dell Products L.P.
    Inventors: Joel R. Goergen, Greg Hunt, Peter Tomaszewski, Joseph Pankow, Michael Laudon
  • Impedance tuning for circuit board signal path surface pad structures
    Patent number: 8119921
    Abstract: The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: February 21, 2012
    Assignee: Force10 Networks, Inc.
    Inventors: Joel R. Goergen, Greg Hunt, Peter Tomaszewski, Joseph Pankow, Michael Laudon
  • Inductance-tuned circuit board via crosstalk structures
    Patent number: 7897880
    Abstract: Plated through holes pass through clearances in a ground plane of a circuit board. A conductive collar/spoke arrangement is constructed on the ground plane adjacent the clearance, to provide an inductive component to the coupling between a plated through hole and the ground plane. The inductive component impedes the transfer of high-frequency noise between the through hole and the ground plane. Other embodiments are also described and claimed.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: March 1, 2011
    Assignee: Force 10 Networks, Inc
    Inventors: Joel R. Goergen, Greg Hunt, Peter Tomaszewski, Joseph Pankow, Michael Laudon