Patents by Inventor Joseph Petrini
Joseph Petrini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11551994Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.Type: GrantFiled: September 24, 2018Date of Patent: January 10, 2023Assignee: Intel CorporationInventors: Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Edvin Cetegen, Betsegaw Gebrehiwot, Feras Eid
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Patent number: 11464139Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.Type: GrantFiled: November 5, 2018Date of Patent: October 4, 2022Assignee: Intel CorporationInventors: Kelly Lofgreen, Joseph Petrini, Todd Coons, Christopher Wade Ackerman, Edvin Cetegen, Yang Jiao, Michael Rutigliano, Kuang Liu
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Publication number: 20200146183Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.Type: ApplicationFiled: November 5, 2018Publication date: May 7, 2020Applicant: Intel CorporationInventors: Kelly Lofgreen, Joseph Petrini, Todd Coons, Christopher Wade Ackerman, Edvin Cetegen, Yang Jiao, Michael Rutigliano, Kuang Liu
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Publication number: 20200098661Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.Type: ApplicationFiled: September 24, 2018Publication date: March 26, 2020Inventors: Kelly LOFGREEN, Chia-Pin CHIU, Joseph PETRINI, Edvin CETEGEN, Betsegaw GEBREHIWOT, Feras EID
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Patent number: 9748199Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.Type: GrantFiled: March 7, 2016Date of Patent: August 29, 2017Assignee: Intel CorporationInventors: Hemanth Dhavaleswarapu, Zhihua Li, Joseph Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew, Amram Eitan
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Publication number: 20160211238Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.Type: ApplicationFiled: March 7, 2016Publication date: July 21, 2016Inventors: Hemanth Dhavaleswarapu, Zhihua Li, Joseph Petrini, Steven B. Roach, Shankar Devasenathipathy, George S. Kostiew, Amram Eitan
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Patent number: 9282650Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.Type: GrantFiled: December 18, 2013Date of Patent: March 8, 2016Assignee: Intel CorporationInventors: Hemanth Dhavaleswarapu, Zhihua Li, Joseph Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew, Amram Eitan
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Publication number: 20150173209Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.Type: ApplicationFiled: December 18, 2013Publication date: June 18, 2015Inventors: Hemanth Dhavaleswarapu, Zhihua Li, Joseph Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew, Amram Eitan
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Publication number: 20130018678Abstract: Family protection insurance provides for a flexible and adjustable insurance policy that can be adjustable to be consistent with changes in the adult's insurance needs. The insurance policy is a term policy where, at predefined intervals, the policy owner may increase the policy value without requiring additional underwriting. The policy owner may also, at any time, convert all or a portion of the term policy to permanent insurance, while still maintaining the term policy and replenish the death benefit amounts of the term policy through the intermittent value increments. Thus, adults may adjust the death benefits of the term policy and convert the term policy death benefits to permanent insurance consistent with changing insurance needs.Type: ApplicationFiled: September 20, 2012Publication date: January 17, 2013Applicant: NEW YORK LIFE INSURANCE COMPANYInventors: Ron Zarrella, Elliot Melis, Joseph A. Petrini, William Morello, Youri Matiounine
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Patent number: 8296166Abstract: Family protection insurance provides for a flexible and adjustable insurance policy that can be adjustable to be consistent with changes in the adult's insurance needs. The insurance policy is a term policy where, at predefined intervals, the policy owner may increase the policy value without requiring additional underwriting. The policy owner may also, at any time, convert all or a portion of the term policy to permanent insurance, while still maintaining the term policy and replenish the death benefit amounts of the term policy through the intermittent value increments. Thus, adults may adjust the death benefits of the term policy and convert the term policy death benefits to permanent insurance consistent with changing insurance needs.Type: GrantFiled: May 8, 2008Date of Patent: October 23, 2012Assignee: New York Life Insurance CompanyInventors: Ron Zarrella, Elliot Melis, Joseph A. Petrini, William Morello, Youri Matiounine
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Publication number: 20090024422Abstract: Family protection insurance provides for a flexible and adjustable insurance policy that can be adjustable to be consistent with changes in the adult's insurance needs. The insurance policy is a term policy where, at predefined intervals, the policy owner may increase the policy value without requiring additional underwriting. The policy owner may also, at any time, convert all or a portion of the term policy to permanent insurance, while still maintaining the term policy and replenish the death benefit amounts of the term policy through the intermittent value increments. Thus, adults may adjust the death benefits of the term policy and convert the term policy death benefits to permanent insurance consistent with changing insurance needs.Type: ApplicationFiled: May 8, 2008Publication date: January 22, 2009Inventors: Ron Zarrella, Elliot Melis, Joseph A. Petrini, William Morello, Youri Matiounine