Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the elemnt(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.

Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the element(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.

Abstract: Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including cuprous ions and stannous ions thereby absorbing on the surface in situ at least said cuprous ions; thereafter treating the surface with a second medium to decrease the solubility of the cuprous ions and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said cuprous ions into a catalytically-active state.

Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.

Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with a liquid containing an activatable complex of copper. The copper-containing complexes of the instant invention are the product of forming solutions comprising a halogen component, a cuprous component and a cupric component. The solutions may optionally be in contact with elemental metal.

Abstract: Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with an activatable complex of copper in a liquid medium formed from a solution comprising a mixture of halogen, cuprous and cupric components and thereafter forming a deposit on the treated article surfaces of a water-insoluble derivative of the said complex. Such surface deposits are treated with a reducing agent or water to enhance their reception of metal in an electroless metal deposition bath.

Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Means to regenerate the composition and a temperature controlled in the range of 20.degree. C. to 100.degree. C. are also described.

Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Resinous surfaces so treated are neutralized in a process including treatment with hydrazine in order to yield metallized resinous surfaces exhibiting superior peel strengths following electroless metal deposition.

Abstract: Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Means to regenerate the composition and a temperature controlled in the range of 20.degree. to 100.degree. C are also described.

Abstract: Non-conductive real images are formed on substrates by depositing reducible metal salt compositions thereon from an aqueous acidic solution of pH 1.5-5 containing bromide ions and exposing the coated substrates to radiant energy to reduce the metal salt to metallic nuclei and to produce a real image of metal, which is intensified and built up by electroless metal deposition. The metal salt composition can either be selectively deposited and then exposed, or uniformly deposited and then selectively exposed, to produce the real image.

Abstract: Sensitizing processes and the resulting new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a halide containing aqueous sensitizing solution of pH 1.5-4.0 that deposits a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

Abstract: Non-conductive real images are formed on substrates by depositing reducible metal salt compositions thereon and exposing the coated substrates to radiant energy or a chemical reducing agent to reduce the metal salt to metallic nuclei and to produce a real image of metal, which is made clearer and built up by electroless metal deposition. The metal salt composition can either be selectively deposited and then exposed, or uniformly deposited and then selectively exposed, to produce the real image.

Abstract: There is provided a process for producing resin rich surfaces of desired and specified thickness and physical, chemical, electrical and/or optical properties involving the use of a transfer base material to move a viscous, liquid, hardenable composition after partial hardening into a non-tacky state into contact with the surface of a second, permanent base, completing the hardening of the composition into a resin-rich surface layer adhering to the second base and subsequently removing the transfer base therefrom. In specific embodiments, the permanent base itself can be hardenable and complete hardening is effected simultaneously; the surface layer can be an adhesive layer; and the surface layer can be catalytic throughout to electroless metal deposition.

Abstract: Radiant energy imaged printed circuit boards are provided by treating an insulating base with a composition of a reducible metal salt and a radiant energy sensitive compound, exposing the treated base to radiant energy in selected areas to produce metallic nuclei in the form of a non-conducting real image of the desired circuit pattern, rinsing the exposed base to remove unexposed metal salts and exposing the real image to an electroless metal bath to build up conductor lines of electroless metal thereon. In an alternative procedure, conductor lines are built up by electroplating with the same or a different metal and, optionally, solder coating.