Patents by Inventor Joseph Pratt
Joseph Pratt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250180167Abstract: A portable fuel gas system includes: a portable enclosure; a processor; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; a fuel gas shutoff valve in the first pressure zone, in electrical communication with the processor and operative to control a flow of a fuel gas in the fuel gas supply manifold; a vent valve in fluid communication with the fuel gas supply manifold and in electrical communication with the processor; and a pressure transmitter in fluid communication with the fuel gas supply manifold and in electrical communication with the processor.Type: ApplicationFiled: August 7, 2024Publication date: June 5, 2025Applicant: ZERO EMISSION INDUSTRIES, INC.Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Publication number: 20240426477Abstract: A burner resistant to flashback is disclosed. In one embodiment the burner includes a wall configured to contain a fuel gas within an enclosed volume of the burner. The burner includes a plurality of apertures formed in the wall. The apertures provide fluid communication from the enclosed volume to an environment surrounding the burner. The plurality of apertures have an effective diameter smaller than a quenching distance of the fuel gas.Type: ApplicationFiled: November 1, 2022Publication date: December 26, 2024Inventors: Joseph Pratt, FRANKLIN TRUSH, DANIEL TERLIP, JOHN M. MOTLOW, CHRISTOPHER D. AINSCOUGH
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Publication number: 20240373546Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: July 16, 2024Publication date: November 7, 2024Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 12092268Abstract: In one example, a portable fuel gas system includes: a portable enclosure; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; and a fuel gas shutoff valve in fluid communication with the fuel gas supply manifold and operative to control a flow of a fuel gas in the fuel gas supply manifold, wherein the fuel gas supply manifold, the throttle, and the fuel gas shutoff valve are disposed within the portable enclosure.Type: GrantFiled: February 8, 2023Date of Patent: September 17, 2024Assignee: ZERO EMISSION INDUSTRIES, INC.Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Patent number: 12052814Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: October 31, 2022Date of Patent: July 30, 2024Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20240218984Abstract: A pressure control device including a valve with a fluid inlet and a fluid outlet, wherein the fluid inlet is in selective fluid communication with the fluid outlet. A heat collector is adapted to cover portion of an envelope of a pressure vessel and operative to receive heat from a heat source. A sensing element is in thermal communication with the heat collector and operative to receive the heat from the heat source. Operative to receiving heat from the sensing element receives the heat, the sensing element actuates the valve to establish the selective fluid communication between the fluid inlet and the fluid outlet.Type: ApplicationFiled: April 27, 2022Publication date: July 4, 2024Inventors: Joseph Pratt, Daniel Terlip, John M. Motlow
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Publication number: 20230235855Abstract: In one example, a portable fuel gas system includes: a portable enclosure; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; and a fuel gas shutoff valve in fluid communication with the fuel gas supply manifold and operative to control a flow of a fuel gas in the fuel gas supply manifold, wherein the fuel gas supply manifold, the throttle, and the fuel gas shutoff valve are disposed within the portable enclosure.Type: ApplicationFiled: February 8, 2023Publication date: July 27, 2023Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Publication number: 20230116550Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: October 31, 2022Publication date: April 13, 2023Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 11603965Abstract: A computer-implemented method of supplying a fuel gas to a fueling system is disclosed. The method may include pre-fill inerting the fueling system; leak-checking the fueling system; charging a pilot subsystem with the fuel gas; filling the fueling system with the fuel gas; and post-fill inerting the fueling system. In many implementations, the fueling system may be associated with a boat. The fuel gas may be hydrogen and may be supplied to a fuel cell that converts the hydrogen to electrical energy to power a propulsion system of the boat.Type: GrantFiled: July 13, 2021Date of Patent: March 14, 2023Assignee: Zero Emissions Industries, Inc.Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Patent number: 11516904Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: November 17, 2021Date of Patent: November 29, 2022Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20220078902Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20220010931Abstract: A computer-implemented method of supplying a fuel gas to a fueling system is disclosed. The method may include pre-fill inerting the fueling system; leak-checking the fueling system; charging a pilot subsystem with the fuel gas; filling the fueling system with the fuel gas; and post-fill inerting the fueling system. In many implementations, the fueling system may be associated with a boat. The fuel gas may be hydrogen and may be supplied to a fuel cell that converts the hydrogen to electrical energy to power a propulsion system of the boat.Type: ApplicationFiled: July 13, 2021Publication date: January 13, 2022Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Patent number: 11206730Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: November 17, 2020Date of Patent: December 21, 2021Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20210076485Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: November 17, 2020Publication date: March 11, 2021Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 10874015Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: April 16, 2020Date of Patent: December 22, 2020Assignee: CELLINK CORPORATIONInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20200245449Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: April 16, 2020Publication date: July 30, 2020Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 10694618Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: October 29, 2019Date of Patent: June 23, 2020Assignee: CELLINK CORPORATIONInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20200137882Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: October 29, 2019Publication date: April 30, 2020Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay