Patents by Inventor Joseph Pratt
Joseph Pratt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230235855Abstract: In one example, a portable fuel gas system includes: a portable enclosure; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; and a fuel gas shutoff valve in fluid communication with the fuel gas supply manifold and operative to control a flow of a fuel gas in the fuel gas supply manifold, wherein the fuel gas supply manifold, the throttle, and the fuel gas shutoff valve are disposed within the portable enclosure.Type: ApplicationFiled: February 8, 2023Publication date: July 27, 2023Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Publication number: 20230116550Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: October 31, 2022Publication date: April 13, 2023Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 11603965Abstract: A computer-implemented method of supplying a fuel gas to a fueling system is disclosed. The method may include pre-fill inerting the fueling system; leak-checking the fueling system; charging a pilot subsystem with the fuel gas; filling the fueling system with the fuel gas; and post-fill inerting the fueling system. In many implementations, the fueling system may be associated with a boat. The fuel gas may be hydrogen and may be supplied to a fuel cell that converts the hydrogen to electrical energy to power a propulsion system of the boat.Type: GrantFiled: July 13, 2021Date of Patent: March 14, 2023Assignee: Zero Emissions Industries, Inc.Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Patent number: 11529039Abstract: Borescopes and related methods that are configured to preclude or minimize imaging in hazy and/or smoky conditions. In some embodiments, the borescope may comprise a shaft made up, at least in part, of a material that is electrically non-conductive material and/or thermally non-conductive, and a tip positioned at a distal end of the shaft. The tip may comprise at least one light source, such as an LED or array of LEDS, configured to deliver electromagnetic radiation in which no more than about 20% of the total spectral output is in the infrared spectrum. The electromagnetic radiation delivered from the at least one light source may comprise a spectrum having at least one of a local maximum and a global maximum between about 450 and about 495 nm. The at least one light source may be configured to deliver between about 20 and about 75 lumens of visible light.Type: GrantFiled: May 8, 2019Date of Patent: December 20, 2022Assignee: Xenocor, Inc.Inventors: Lane G. Brooks, Christopher Joseph Pratt, Ashok C. Khandkar, John T. Langell, Dennis James Muhlestein
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Patent number: 11533070Abstract: Some embodiments herein describe a radio frequency power semiconductor device that include a first non-linear filter network for compensating for lower frequency noise of a power amplifier. The first non-linear filter network can include a plurality of infinite impulse response filters and corresponding corrective elements to correct for a non-linear portion of the power amplifier. The radio frequency power semiconductor device can further include a second non-linear filter network for compensating for broadband distortion. The second non-linear filter network can be connected in parallel to the first non-linear filter network. The broadband distortion can include digital predistortion and the narrowband distortion can include charge trapping effects. The first non-linear filter network can comprise Laguerre filters. The second non-linear filter network can comprise general memory polynomial filters.Type: GrantFiled: November 16, 2020Date of Patent: December 20, 2022Assignee: Analog Devices International Unlimited CompanyInventors: Patrick Joseph Pratt, Dong Chen, Mark Cope, Christopher Mayer, Praveen Chandrasekaran, Stephen Summerfield
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Patent number: 11516904Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: November 17, 2021Date of Patent: November 29, 2022Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 11387790Abstract: The disclosed technology relates generally to semiconductor devices, and more particularly to power semiconductor devices in which effects of charge trapping are compensated. A radio frequency (RF) power transmitter system comprises a RF power semiconductor device that outputs a time-varying gain characteristic from a RF signal input waveform originating from a digital input, wherein the time-varying gain characteristic includes a gain error associated with charge-trapping events having a memory effect on the RF power semiconductor device lasting longer than 1 microsecond. The RF power transmitter system further comprises circuitry configured to apply an analog gate bias waveform to the RF power semiconductor device based on the time-varying gain characteristic to reduce the gain error.Type: GrantFiled: January 14, 2020Date of Patent: July 12, 2022Assignee: Analog Devices International Unlimited CompanyInventors: Mark Cope, Patrick Joseph Pratt
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Publication number: 20220078902Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20220010931Abstract: A computer-implemented method of supplying a fuel gas to a fueling system is disclosed. The method may include pre-fill inerting the fueling system; leak-checking the fueling system; charging a pilot subsystem with the fuel gas; filling the fueling system with the fuel gas; and post-fill inerting the fueling system. In many implementations, the fueling system may be associated with a boat. The fuel gas may be hydrogen and may be supplied to a fuel cell that converts the hydrogen to electrical energy to power a propulsion system of the boat.Type: ApplicationFiled: July 13, 2021Publication date: January 13, 2022Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
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Patent number: 11206730Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: November 17, 2020Date of Patent: December 21, 2021Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20210194521Abstract: Some embodiments herein describe a radio frequency power semiconductor device that include a first non-linear filter network for compensating for lower frequency noise of a power amplifier. The first non-linear filter network can include a plurality of infinite impulse response filters and corresponding corrective elements to correct for a non-linear portion of the power amplifier. The radio frequency power semiconductor device can further include a second non-linear filter network for compensating for broadband distortion. The second non-linear filter network can be connected in parallel to the first non-linear filter network. The broadband distortion can include digital predistortion and the narrowband distortion can include charge trapping effects. The first non-linear filter network can comprise Laguerre filters. The second non-linear filter network can comprise general memory polynomial filters.Type: ApplicationFiled: November 16, 2020Publication date: June 24, 2021Inventors: Patrick Joseph Pratt, Dong Chen, Mark Cope, Christopher Mayer, Praveen Chandrasekaran, Stephen Summerfield
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Publication number: 20210076485Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: November 17, 2020Publication date: March 11, 2021Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 10874015Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: April 16, 2020Date of Patent: December 22, 2020Assignee: CELLINK CORPORATIONInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20200244232Abstract: The disclosed technology relates generally to semiconductor devices, and more particularly to power semiconductor devices in which effects of charge trapping are compensated. A radio frequency (RF) power transmitter system comprises a RF power semiconductor device that outputs a time-varying gain characteristic from a RF signal input waveform originating from a digital input, wherein the time-varying gain characteristic includes a gain error associated with charge-trapping events having a memory effect on the RF power semiconductor device lasting longer than 1 microsecond. The RF power transmitter system further comprises circuitry configured to apply an analog gate bias waveform to the RF power semiconductor device based on the time-varying gain characteristic to reduce the gain error.Type: ApplicationFiled: January 14, 2020Publication date: July 30, 2020Inventors: Mark Cope, Patrick Joseph Pratt
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Publication number: 20200245449Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: April 16, 2020Publication date: July 30, 2020Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Patent number: 10694618Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: October 29, 2019Date of Patent: June 23, 2020Assignee: CELLINK CORPORATIONInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20200137882Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: October 29, 2019Publication date: April 30, 2020Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20190343371Abstract: Borescopes and related methods that are configured to preclude or minimize imaging in hazy and/or smoky conditions. In some embodiments, the borescope may comprise a shaft made up, at least in part, of a material that is electrically non-conductive material and/or thermally non-conductive, and a tip positioned at a distal end of the shaft. The tip may comprise at least one light source, such as an LED or array of LEDS, configured to deliver electromagnetic radiation in which no more than about 20% of the total spectral output is in the infrared spectrum. The electromagnetic radiation delivered from the at least one light source may comprise a spectrum having at least one of a local maximum and a global maximum between about 450 and about 495 nm. The at least one light source may be configured to deliver between about 20 and about 75 lumens of visible light.Type: ApplicationFiled: May 8, 2019Publication date: November 14, 2019Inventors: Lane G. Brooks, Christopher Joseph Pratt, Ashok C. Khandkar, John T. Langell, Dennis James Muhlestein
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Publication number: 20190208143Abstract: Borescopes, such as laparoscopes and endoscopes, configured to provide for image reorientation. In some embodiments, a portion of the borescope, such as the handle, may be rotatable with respect to another portion of the borescope, such as the shaft/tube. A sensor may be provided to translate the rotational positions of these two portions into digital data to allow an image or stream of images to be digitally rotated, preferably in real time, so that a camera module and/or image sensor may be fixed to the tube, such as positioned in a distal tip of the tube, without compromising the ability of the device to allow a surgeon to fix the rotational orientation of the images in a desired manner.Type: ApplicationFiled: January 3, 2019Publication date: July 4, 2019Inventors: Lane G. Brooks, Christopher Joseph Pratt, Dennis James Muhlestein, John T. Langell, Ashok C. Khandkar
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Patent number: 10039020Abstract: A single complex calculation for locating a dominant frequency, such as an interfering signal in a frequency range, is replaced by several much easier ones. A signal is analyzed over a first frequency range to locate at least one comparatively significant frequency component therein. This can involve analyzing, using electronic hardware, a test range of frequencies to identify a potentially significant component within the test range; and determining, using electronic hardware, if a condition for finishing the analysis has been met. If the condition has not been met, the test range is modified as a result of the analysis and the operations of analyzing and determining are repeated.Type: GrantFiled: October 17, 2014Date of Patent: July 31, 2018Assignee: Analog Devices GlobalInventor: Patrick Joseph Pratt