Patents by Inventor Joseph Pratt

Joseph Pratt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250180167
    Abstract: A portable fuel gas system includes: a portable enclosure; a processor; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; a fuel gas shutoff valve in the first pressure zone, in electrical communication with the processor and operative to control a flow of a fuel gas in the fuel gas supply manifold; a vent valve in fluid communication with the fuel gas supply manifold and in electrical communication with the processor; and a pressure transmitter in fluid communication with the fuel gas supply manifold and in electrical communication with the processor.
    Type: Application
    Filed: August 7, 2024
    Publication date: June 5, 2025
    Applicant: ZERO EMISSION INDUSTRIES, INC.
    Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
  • Publication number: 20240426477
    Abstract: A burner resistant to flashback is disclosed. In one embodiment the burner includes a wall configured to contain a fuel gas within an enclosed volume of the burner. The burner includes a plurality of apertures formed in the wall. The apertures provide fluid communication from the enclosed volume to an environment surrounding the burner. The plurality of apertures have an effective diameter smaller than a quenching distance of the fuel gas.
    Type: Application
    Filed: November 1, 2022
    Publication date: December 26, 2024
    Inventors: Joseph Pratt, FRANKLIN TRUSH, DANIEL TERLIP, JOHN M. MOTLOW, CHRISTOPHER D. AINSCOUGH
  • Publication number: 20240373546
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Application
    Filed: July 16, 2024
    Publication date: November 7, 2024
    Applicant: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Patent number: 12092268
    Abstract: In one example, a portable fuel gas system includes: a portable enclosure; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; and a fuel gas shutoff valve in fluid communication with the fuel gas supply manifold and operative to control a flow of a fuel gas in the fuel gas supply manifold, wherein the fuel gas supply manifold, the throttle, and the fuel gas shutoff valve are disposed within the portable enclosure.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: September 17, 2024
    Assignee: ZERO EMISSION INDUSTRIES, INC.
    Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
  • Patent number: 12052814
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: July 30, 2024
    Assignee: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Publication number: 20240218984
    Abstract: A pressure control device including a valve with a fluid inlet and a fluid outlet, wherein the fluid inlet is in selective fluid communication with the fluid outlet. A heat collector is adapted to cover portion of an envelope of a pressure vessel and operative to receive heat from a heat source. A sensing element is in thermal communication with the heat collector and operative to receive the heat from the heat source. Operative to receiving heat from the sensing element receives the heat, the sensing element actuates the valve to establish the selective fluid communication between the fluid inlet and the fluid outlet.
    Type: Application
    Filed: April 27, 2022
    Publication date: July 4, 2024
    Inventors: Joseph Pratt, Daniel Terlip, John M. Motlow
  • Publication number: 20230235855
    Abstract: In one example, a portable fuel gas system includes: a portable enclosure; a fuel gas supply manifold; a throttle in fluid communication with the fuel gas supply manifold. The fuel gas supply manifold includes a first pressure zone and a second pressure zone separated from one another by the throttle; and a fuel gas shutoff valve in fluid communication with the fuel gas supply manifold and operative to control a flow of a fuel gas in the fuel gas supply manifold, wherein the fuel gas supply manifold, the throttle, and the fuel gas shutoff valve are disposed within the portable enclosure.
    Type: Application
    Filed: February 8, 2023
    Publication date: July 27, 2023
    Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
  • Publication number: 20230116550
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Application
    Filed: October 31, 2022
    Publication date: April 13, 2023
    Applicant: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Patent number: 11603965
    Abstract: A computer-implemented method of supplying a fuel gas to a fueling system is disclosed. The method may include pre-fill inerting the fueling system; leak-checking the fueling system; charging a pilot subsystem with the fuel gas; filling the fueling system with the fuel gas; and post-fill inerting the fueling system. In many implementations, the fueling system may be associated with a boat. The fuel gas may be hydrogen and may be supplied to a fuel cell that converts the hydrogen to electrical energy to power a propulsion system of the boat.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: March 14, 2023
    Assignee: Zero Emissions Industries, Inc.
    Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
  • Patent number: 11516904
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: November 29, 2022
    Assignee: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Publication number: 20220078902
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 10, 2022
    Applicant: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Publication number: 20220010931
    Abstract: A computer-implemented method of supplying a fuel gas to a fueling system is disclosed. The method may include pre-fill inerting the fueling system; leak-checking the fueling system; charging a pilot subsystem with the fuel gas; filling the fueling system with the fuel gas; and post-fill inerting the fueling system. In many implementations, the fueling system may be associated with a boat. The fuel gas may be hydrogen and may be supplied to a fuel cell that converts the hydrogen to electrical energy to power a propulsion system of the boat.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 13, 2022
    Inventors: Joseph Pratt, Adrian Narvaez, Daniel Terlip
  • Patent number: 11206730
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: December 21, 2021
    Assignee: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Publication number: 20210076485
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Application
    Filed: November 17, 2020
    Publication date: March 11, 2021
    Applicant: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Patent number: 10874015
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: December 22, 2020
    Assignee: CELLINK CORPORATION
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Publication number: 20200245449
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 30, 2020
    Applicant: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Patent number: 10694618
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: June 23, 2020
    Assignee: CELLINK CORPORATION
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Publication number: 20200137882
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Application
    Filed: October 29, 2019
    Publication date: April 30, 2020
    Applicant: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay