Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.

Abstract: An electronic subsystem such as an array of radar transmit/receive microwave modules are associated with (e.g., base mounted to) spaced heat sinks. There is an electronic module on each side of each heat sink and an inflatable bladder or “pneumatic pressure wedge” between adjacent heat sinks biases a pair of electronic modules against their respective heat sinks.

Abstract: A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser.

Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.

Abstract: A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.

Abstract: A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.

Abstract: An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.

Abstract: An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.