Abstract: An assembly is provided for an electronic system. This electronic system includes a base and an electronic component. The base includes a base connector, a bay and a first guide. The first guide is arranged along a first side of the bay. The electronic component is configured to mate with the first guide and to move along the first guide within the bay to an installed position. The electronic component includes a component connector and a brake. The component connector is configured to couple with the base connector when the electronic component is at the installed position. The brake is engageable as the electronic component moves along the first guide to the installed position.

Abstract: An assembly is provided for an electronic system. This electronic system includes a base and an electronic component. The base includes a base connector, a bay and a first guide. The first guide is arranged along a first side of the bay. The electronic component is configured to mate with the first guide and to move along the first guide within the bay to an installed position. The electronic component includes a component connector and a brake. The component connector is configured to couple with the base connector when the electronic component is at the installed position. The brake is engageable as the electronic component moves along the first guide to the installed position.

Abstract: A modular phased array antenna that includes a plurality of modular antenna array blocks assembled together as a single antenna array and an array face having an array plate and a radiator and radome assembly for each modular block interlocked and aligned to create a single monolithic array face. Each modular antenna array block includes: a plurality of transmit/receive integrated multichannel module (TRIMM) cards, each TRIMM card including power and beamforming signals, where power and beamforming signals are connected in parallel to each modular antenna array block, a plurality of radiators for radiating antenna signals having a radiator face, a radome integrated with the plurality of radiators and interfacing directly to the radiator face, where the radome does not extend beyond the radiator face, and a frame for supporting the TRIMM cards.

Abstract: A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.

Abstract: An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.

Abstract: A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.

Abstract: A modular phased array antenna that includes a plurality of modular antenna array blocks assembled together as a single antenna array and an array face having an array plate and a radiator and radome assembly for each modular block interlocked and aligned to create a single monolithic array face.

Abstract: A coolant interface includes a line replaceable unit (LRU) inserted into a slot within a modular assembly such as a chassis for an electronics assembly. Quick disconnect fluid coupling fittings on the LRU mate with counterpart fittings on a fluid distribution manifold within the chassis when the LRU is inserted into the slot. A seal surrounding the quick disconnect fluid coupling fittings on a flat surface abutting a counterpart surface on the fluid distribution manifold when the LRU is inserted into the slot compresses the seal against the counterpart surface. Alignment pin(s) projecting from the flat surface and received by corresponding guide holes within the counterpart surface, and captive hardware provides pressure between the flat surface and the counterpart surface to increase and maintain compression of the seal. The alignment pins and captive hardware are arranged to increase mechanical stability of the connection.

Abstract: A coolant interface includes a line replaceable unit (LRU) inserted into a slot within a modular assembly such as a chassis for an electronics assembly. Quick disconnect fluid coupling fittings on the LRU mate with counterpart fittings on a fluid distribution manifold within the chassis when the LRU is inserted into the slot. A seal surrounding the quick disconnect fluid coupling fittings on a flat surface abutting a counterpart surface on the fluid distribution manifold when the LRU is inserted into the slot compresses the seal against the counterpart surface. Alignment pin(s) projecting from the flat surface and received by corresponding guide holes within the counterpart surface, and captive hardware provides pressure between the flat surface and the counterpart surface to increase and maintain compression of the seal. The alignment pins and captive hardware are arranged to increase mechanical stability of the connection.

Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).