Patents by Inventor Joseph R. Ellsworth

Joseph R. Ellsworth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9999155
    Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: June 12, 2018
    Assignee: Raytheon Company
    Inventors: David A. Brooks, Joseph R. Ellsworth, Costas Karageorgis, Corey R. DeLisle, Joseph M. Crowder
  • Publication number: 20160205806
    Abstract: An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 14, 2016
    Inventors: David A. Brooks, Joseph R. Ellsworth, Costas Karageorgis, Corey R. DeLisle, Joseph M. Crowder
  • Patent number: 9116222
    Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: August 25, 2015
    Assignee: Raytheon Company
    Inventors: Joseph R. Ellsworth, Michael P. Martinez, Craig H. McCordic, Jeffrey Paquette, Scott R. Cheyne
  • Patent number: 8810448
    Abstract: In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: August 19, 2014
    Assignee: Raytheon Company
    Inventors: Joseph R. Ellsworth, Michael P. Martinez, Craig H. McCordic, Jeffrey Paquette, Scott R. Cheyne
  • Patent number: 8537552
    Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: September 17, 2013
    Assignee: Raytheon Company
    Inventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth, Michael P. Martinez, Michael R. Trahan
  • Patent number: 8508943
    Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: August 13, 2013
    Assignee: Raytheon Company
    Inventors: Paul A. Danello, Scott R. Cheyne, Joseph R. Ellsworth, Thomas J. Tellinghuisen
  • Patent number: 8363413
    Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: January 29, 2013
    Assignee: Raytheon Company
    Inventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth
  • Publication number: 20120146862
    Abstract: In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.
    Type: Application
    Filed: October 16, 2009
    Publication date: June 14, 2012
    Applicant: Raytheon Company
    Inventors: Paul A. Danello, Scott R. Cheyne, Joseph R. Ellsworth, Thomas J. Tellinghuisen
  • Publication number: 20120063098
    Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.
    Type: Application
    Filed: September 13, 2010
    Publication date: March 15, 2012
    Applicant: Raytheon Company
    Inventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth
  • Publication number: 20110075377
    Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
    Type: Application
    Filed: September 25, 2009
    Publication date: March 31, 2011
    Applicant: Raytheon Copany
    Inventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth, Michael P. Martinez, Michael R. Trahan
  • Patent number: 7859835
    Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: December 28, 2010
    Assignee: Allegro Microsystems, Inc.
    Inventors: Angelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
  • Publication number: 20100245179
    Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).
    Type: Application
    Filed: June 10, 2009
    Publication date: September 30, 2010
    Applicant: Raytheon Company
    Inventors: Angelo M. Puzella, Joseph A. Licciardello, Stephen J. Pereira, Joseph R. Ellsworth
  • Patent number: 7742307
    Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: June 22, 2010
    Assignee: Raytheon Company
    Inventors: Joseph R. Ellsworth, Michael P. Martinez, Stephen J. Pereira
  • Publication number: 20100039770
    Abstract: An electronic subsystem such as an array of radar transmit/receive microwave modules are associated with (e.g., base mounted to) spaced heat sinks. There is an electronic module on each side of each heat sink and an inflatable bladder or “pneumatic pressure wedge” between adjacent heat sinks biases a pair of electronic modules against their respective heat sinks.
    Type: Application
    Filed: August 15, 2008
    Publication date: February 18, 2010
    Inventors: Paul A. Danello, Michael P. Martinez, Russell D. Belanger, Joaquim A. Bento, Joseph R. Ellsworth
  • Publication number: 20100038056
    Abstract: A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser.
    Type: Application
    Filed: August 15, 2008
    Publication date: February 18, 2010
    Inventors: Joseph R. Ellsworth, Scott R. Cheyne, Michael E. Null, Michael P. Martinez, David H. Altman, Anthony J. Burdi
  • Publication number: 20090185352
    Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 23, 2009
    Inventors: Joseph R. Ellsworth, Michael P. Martinez, Stephen J. Pereira
  • Patent number: 7548424
    Abstract: A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: June 16, 2009
    Assignee: Raytheon Company
    Inventors: David H. Altman, Joseph R. Ellsworth, Michael E. Null
  • Publication number: 20080225485
    Abstract: A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 18, 2008
    Inventors: David H. Altman, Joseph R. Ellsworth, Michael E. Null
  • Patent number: 6903931
    Abstract: An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: June 7, 2005
    Assignee: Raytheon Company
    Inventors: Craig H. McCordic, Steven M. Lombardo, Joseph R. Ellsworth
  • Publication number: 20030230400
    Abstract: An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.
    Type: Application
    Filed: June 13, 2002
    Publication date: December 18, 2003
    Inventors: Craig H. McCordic, Steven M. Lombardo, Joseph R. Ellsworth