Patents by Inventor Joseph R. Laia

Joseph R. Laia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7724003
    Abstract: A measurement system for taking a reading in a test zone on a surface of a substrate. A chamber forms an environment, a surface treatment station dispenses a stabilizing chemical in the test zone, a charge deposition station deposits a charge in the test zone, and a QV measurement station takes a QV based measurement in the test zone. Where the surface treatment station, the charge deposition station, and the QV measurement station all interact with the substrate within the chamber. In this manner, reliable QV measurements are taken on the substrate by controlling charge spreading with the stabilizing chemical. QV measurement stability is also improved by reducing the influence of the time trending on substrates with reactive dielectrics, such as on silicon oxynitride and high-k surfaces.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: May 25, 2010
    Assignee: KLA-Tencor Corporation
    Inventors: NanChang Zhu, Jainou Shi, Min Xiang, ZiangHua Liu, Goujun Zhang, Xiafang Zhang, Shiyou Pei, Liang-Guo Wang, Joseph R. Laia, Jr.
  • Patent number: 6265320
    Abstract: A method of limiting surface damage during reactive ion etching of an organic polymer layer on a semiconductor substrate combines particular choices of process gases and plasma conditions with a post-etch passivation treatment. According to the method, a low density plasma etcher is used with a process gas mixture of one or more of an inert gas such as argon, helium, or nitrogen; methane; hydrogen; and oxygen, where the percentage of oxygen is up to about 5%. Typically a parallel plate plasma etcher is used. The reactive ion etching is followed by a post-etch passivation treatment in a which a gas containing hydrogen is flowed over the etched layer at an elevated temperature. The method is particularly useful in reactive ion etching of fluorinated organic polymer layers such as films formed from parylene AF4, and layers of poly(arylene ethers) and TEFLON®.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: July 24, 2001
    Assignee: Novellus Systems, Inc.
    Inventors: Jianou Shi, Thomas W. Mountsier, Mary Anne Plano, Joseph R. Laia
  • Patent number: 5783335
    Abstract: A process for coating a substrate with diamond or diamond-like material including maintaining a substrate within a bed of particles capable of being fluidized, the particles having substantially uniform dimensions and the substrate characterized as having different dimensions than the bed particles, fluidizing the bed of particles, and depositing a coating of diamond or diamond-like material upon the substrate by chemical vapor deposition of a carbon-containing precursor gas mixture, the precursor gas mixture introduced into the fluidized bed under conditions resulting in excitation mechanisms sufficient to form the diamond coating.
    Type: Grant
    Filed: April 7, 1992
    Date of Patent: July 21, 1998
    Assignee: The Regents of the University of California, Office of Technology Transfer
    Inventors: Joseph R. Laia, Jr., David W. Carroll, Mitchell Trkula, Wallace E. Anderson, Steven M. Valone
  • Patent number: 5254374
    Abstract: A method for producing reinforced ceramic composite articles by means of chemical vapor infiltration and deposition in which an inverted temperature gradient is utilized. Microwave energy is the source of heat for the process.
    Type: Grant
    Filed: April 8, 1992
    Date of Patent: October 19, 1993
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: David J. Devlin, Robert P. Currier, Joseph R. Laia, Jr., Robert S. Barbero
  • Patent number: 5149596
    Abstract: A highly pure thin metal film having a nanocrystalline structure and a process of preparing such highly pure thin metal films of, e.g., rhodium, iridium, molybdenum, tungsten, rhenium, platinum, or palladium by plasma assisted chemical vapor deposition of, e.g., rhodium(allyl).sub.3, iridium(allyl).sub.3, molybdenum(allyl).sub.4, tungsten(allyl).sub.4, rhenium(allyl).sub.4, platinum(allyl).sub.2, or palladium(allyl).sub.2 are disclosed. Additionally, a general process of reducing the carbon content of a metallic film prepared from one or more organometallic precursor compounds by plasma assisted chemical vapor deposition is disclosed.
    Type: Grant
    Filed: October 5, 1990
    Date of Patent: September 22, 1992
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: David C. Smith, Stevan G. Pattillo, Joseph R. Laia, Jr., Alfred P. Sattelberger