Abstract: A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to the first face. The segments include a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions is integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer. A plurality of second segments is secured to the second face, the second segments including a substrate having a first surface and a second surface opposite the first surface. Each of the second segments includes a plurality of protrusions integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer.

Abstract: A pad conditioner and chemical mechanical planarization (CMP) pad conditioner assembly for a CMP assembly are disclosed. The pad conditioner includes a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions protrude away from the first surface in a direction that is normal to the first surface. The plurality of protrusions are arranged in a plurality of rows. A first row of the plurality of rows is offset from a second row of the plurality of rows.