Abstract: A silicone composition comprising (A) an electrically conductive filler, (B) a polydiorganosiloxane polymer, (C) a polyorganohydrogensiloxane, (D) a hydrosilylation reaction catalyst, (E) a polymer additive, and optionally (F) a hydrosilylation reaction inhibitor has a low complex viscosity upon admixing and upon cure provides a high electrical conductivity and good electrical conductivity retention after heat aging.

Abstract: A curable organopolysiloxane composition that is one component, has superior storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate usable time is provided. In particular, the composition has excellent curability even at temperatures of 80° C. or lower and excellent adhesion to resins such as polyester and polyphenylene sulfide. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a hydrosilylation reaction catalyst; (D) a condensation reaction catalyst or a condensation reaction product thereof selected from the group consisting of tetra-tert-butoxy titanium, di(isopropoxy)bis(ethyl acetoacetate)titanium, and an aluminum chelate complex; and (E) a curing inhibitor. When cured, the composition provides a silicone rubber composition with a JIS A hardness of 5 or higher.