Patents by Inventor Joseph S. Duthie

Joseph S. Duthie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6804495
    Abstract: The present invention relates to a towed/surrogate decoy transmitter connectable via the tow cable to a platform or host aircraft using a wireless communicator link, the link providing useful performance and status information of the decoy transmitter to the host aircraft and providing the decoy with control and optimization information from the platform. The tow cable provides a mechanical connection to the host aircraft as well as a prime power connection and in some cases, a fiber optic (FO) interface. In order to optimize the protection provided by the towed/surrogate decoy transmitter, the host aircraft will use the wireless communication link to transmit operational status and control adjustment data back to the towed/surrogate decoy transmitter. The towed/surrogate decoy transmitter utilizes a wireless communicator link that can transmit data to any cooperative host aircraft and any other cooperative towed/surrogate decoy transmitters.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: October 12, 2004
    Assignee: Northrop Grumman Corporation
    Inventor: Joseph S. Duthie
  • Publication number: 20030068981
    Abstract: The present invention relates to a towed/surrogate decoy transmitter connectable via the tow cable to a platform or host aircraft using a wireless communicator link, the link providing useful performance and status information of the decoy transmitter to the host aircraft and providing the decoy with control and optimization information from the platform. The tow cable provides a mechanical connection to the host aircraft as well as a prime power connection and in some cases, a fiber optic (FO) interface. In order to optimize the protection provided by the towed/surrogate decoy transmitter, the host aircraft will use the wireless communication link to transmit operational status and control adjustment data back to the towed/surrogate decoy transmitter. The towed/surrogate decoy transmitter utilizes a wireless communicator link that can transmit data to any cooperative host aircraft and any other cooperative towed/surrogate decoy transmitters.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 10, 2003
    Inventor: Joseph S. Duthie
  • Patent number: 6483371
    Abstract: A universal temperature compensation circuit for use with a temperature sensor operative to generate an analog temperature signal based on the temperature thereof. The universal temperature compensation circuit comprises an analog to digital converter in electrical communication with the temperature sensor. The analog to digital converter is operative to generate a digital temperature signal from the analog temperature signal. In electrical communication with the analog to digital converter is an electronic storage device containing digital data correlated to temperatures of the temperature sensor. The universal temperature compensation circuit further includes a digital to analog converter in electrical communication with the electronic storage device. The digital to analog converter is operative to generate an analog voltage level from the digital data contained within the electronic storage device.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: November 19, 2002
    Assignee: Northrop Grumman Corporation
    Inventors: Joseph S. Duthie, Daniel J. Blase, Michael S. Lupescu
  • Patent number: 5694300
    Abstract: A multi-chip module (10) has a plurality of functional circuits each disposed within its own cavity (15-18), each cavity separated from the other by isolation channels (20, 21). Each functional circuit includes a plurality of monolithic microwave or high speed digital integrated circuit chips (29-33) which are wire bonded or flip-chip attached to the multi-chip module, and each is encapsulated in plastic (37) overmold compound. Complete electromagnetic shielding is provided by depositing metal (23) over the channels and the plastic encapsulation, thereby providing a totally electromagnetically channelized and shielded multi-circuit, microwave and/or high speed digital integrated circuit board.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: December 2, 1997
    Assignee: Northrop Grumman Corporation
    Inventors: Carmelo J. Mattei, Joseph S. Duthie