Abstract: A modular adhesive bead dispensing unit having at least one bead dispensing module. The module includes a mounting frame for mounting the module to the unit, and at least one adhesive dispensing manifold. The manifold includes a housing having an inlet opening for introducing adhesive into the housing, an outlet opening for dispensing the adhesive, a non-stick compressible fitting within the outlet opening, the fitting having an opening therethrough, and an outlet closing member receivable within the fitting opening for starting and stopping flow of an adhesive bead from the head. The module also includes at least one actuation unit for retracting and reinstalling the outlet closing member within the fitting opening. The manifold for dispensing adhesive has a sleeve mounted in the outlet opening, adjacent the fitting, and a retainer for retaining the fitting within the outlet opening and for adjustably pressing the fitting into the sleeve.