Patents by Inventor Joseph Sattler

Joseph Sattler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926795
    Abstract: Catalyst systems are provided for reforming of hydrocarbons, along with methods for using such catalyst systems. The catalyst systems can be deposited or otherwise coated on a surface or structure, such as a monolith, to achieve improved activity and/or structural stability. The metal oxide support layer can correspond to a thermally stable metal oxide support layer, such as a metal oxide support layer that is thermally phase stable at temperatures of 800° C. to 1600° C. The catalyst systems can be beneficial for use in cyclical reaction environments, such as reverse flow reactors or other types of reactors that are operated using flows in opposing directions and different times within a reaction cycle.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: March 12, 2024
    Assignee: EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY
    Inventors: Changmin Chun, Wesley Sattler, Joseph E. Gatt, Keith R. Hajkowski, Everett J. O'Neal, William R. Gunther, Anastasios Skoulidas
  • Patent number: 5926696
    Abstract: A pad grid array plastic package includes a laminated plastic body with a centrally located cavity, an IC unit secured within the cavity, and an encapsulating organic polymer, such as epoxy, enclosing the cavity. The laminated body includes a substrate and a structural member on top of the substrate and having a centrally located aperture forming the cavity. The substrate is provided with metal patterns on both planar surfaces thereof, through-plated vias electrically connecting the metal patterns, and a grid array of contact pads on the bottom surface of the substrate, electrically connected to the metal pattern. The structural member provides strength and rigidity to the laminate and is sufficiently thick to enable protection of the IC unit when the cavity is enclosed with the encapsulating polymer. Also disclosed is a method of making the package and a laminate with the cavity, metal patterns and grid pad array for use in assembling the package.
    Type: Grant
    Filed: May 30, 1996
    Date of Patent: July 20, 1999
    Assignee: Lucent Technologies Inc.
    Inventors: George Addis Baxter, Charles Cohn, Theodore Joseph Sattler, Lakshmendra S. Saxena
  • Patent number: D996433
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: August 22, 2023
    Assignee: CONTOUR DESIGN NORDIC A/S
    Inventors: Joseph Sattler, Andrew David Morgan