Patents by Inventor Joseph Schug

Joseph Schug has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB support plate for PCB via fill
    Patent number: 6855385
    Abstract: Apparatus for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: February 15, 2005
    Assignee: TTM Advanced Circuits, Inc.
    Inventors: Charles W. Lewis, Jesse Pedigo, Joseph Schug
  • PCB support plate method for PCB via fill
    Patent number: 6800232
    Abstract: Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: October 5, 2004
    Assignee: TTM Advanced Circuits, Inc.
    Inventors: Charles W. Lewis, Jesse Pedigo, Joseph Schug
  • PCB support plate method for PCB via fill
    Publication number: 20030011098
    Abstract: Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.
    Type: Application
    Filed: July 22, 2002
    Publication date: January 16, 2003
    Inventors: Charles W. Lewis, Jesse Pedigo, Joseph Schug
  • PCB support plate for PCB via fill
    Publication number: 20020179676
    Abstract: Apparatus for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.
    Type: Application
    Filed: July 22, 2002
    Publication date: December 5, 2002
    Inventors: Charles W. Lewis, Jesse Pedigo, Joseph Schug