Patents by Inventor Joseph Seeger

Joseph Seeger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10551193
    Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: February 4, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Joseph Seeger, Ozan Anac
  • Patent number: 10527421
    Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: January 7, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Ozan Anac, Joseph Seeger
  • Patent number: 10527420
    Abstract: A MEMS device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure. The MEMS device additionally includes at least one secondary bump stop situated at a second distance from the target structure, wherein the second distance is greater than the first distance, and further wherein the at least one elastic bump stop moves to reduce the first distance when a shock is applied.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 7, 2020
    Assignee: Invensense, Inc.
    Inventors: Jin Qiu, Joseph Seeger
  • Publication number: 20190382259
    Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.
    Type: Application
    Filed: September 1, 2019
    Publication date: December 19, 2019
    Inventors: MATTHEW JULIAN THOMPSON, STEPHEN LLOYD, JOSEPH SEEGER
  • Patent number: 10505006
    Abstract: A method includes depositing a silicon layer over a first oxide layer that overlays a first silicon substrate. The method further includes depositing a second oxide layer over the silicon layer to form a composite substrate. The composite substrate is bonded to a second silicon substrate to form a micro-electro-mechanical system (MEMS) substrate. Holes within the second silicon substrate are formed by reaching the second oxide layer of the composite substrate. The method further includes removing a portion of the second oxide layer through the holes to release MEMS features. The MEMS substrate may be bonded to a CMOS substrate.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 10, 2019
    Assignee: InvenSense, Inc.
    Inventors: Bongsang Kim, Jongwoo Shin, Joseph Seeger, Logeeswaran Veerayah Jayaraman, Houri Johari-Galle
  • Publication number: 20190359479
    Abstract: A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Inventors: Ilya Gurin, Joseph Seeger, Matthew Thompson
  • Publication number: 20190345024
    Abstract: A sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure. The substrate includes a first side and a second side. The first side is opposite to the second side. The substrate comprises a cavity on the first side. The electrode is positioned at a bottom of the cavity on the first side of the substrate. The deformable membrane is positioned on the first side of the substrate. The deformable membrane encloses the cavity and deforms responsive to external stimuli. The compensation structure is connected to outer periphery of the deformable membrane. The compensation structure creates a bending force that is opposite to a bending force of the deformable membrane responsive to temperature changes and thermal coefficient mismatch.
    Type: Application
    Filed: August 22, 2018
    Publication date: November 14, 2019
    Inventors: Chung-Hsien LIN, Joseph SEEGER, Calin MICLAUS, Tsung Lin TANG, Pei-Wen YEN
  • Patent number: 10451418
    Abstract: A system and/or method for utilizing quadrature signals, for example in a MEMS gyroscope, to control drive signal characteristics (e.g., amplitude, etc.). As a non-limiting example, a quadrature signal in a MEMS gyroscope may be isolated and/or processed to generate a drive signal that is used to drive a proof mass. Such a quadrature signal may, for example, be obtained passively as part of general Coriolis signal processing. Also for example, such a quadrature signal may be actively created and/or obtained through the use of electrical and/or mechanical features.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: October 22, 2019
    Assignee: InvenSense, Inc.
    Inventor: Joseph Seeger
  • Patent number: 10427930
    Abstract: A system and/or method for utilizing microelectromechanical systems (MEMS) switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: October 1, 2019
    Assignee: InvenSense, Inc.
    Inventors: Matthew Thompson, Joseph Seeger
  • Patent number: 10421659
    Abstract: A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: September 24, 2019
    Assignee: InvenSense, Inc.
    Inventors: Ilya Gurin, Joseph Seeger, Matthew Thompson
  • Patent number: 10415994
    Abstract: A self-test method by rotating the proof mass at a high frequency enables testing the functionality of both the drive and sense systems at the same time. In this method, the proof mass is rotated at a drive frequency. An input force which is substantially two times the drive frequency is applied to the actuation structures to rotate the proof mass of the gyroscope around the sensitive axis orthogonal to the drive axis. An output response of the gyroscope at the drive frequency is detected by a circuitry and a self-test response is obtained.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: September 17, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Ozan Anac, Joseph Seeger
  • Patent number: 10399849
    Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: September 3, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Matthew Julian Thompson, Stephen Lloyd, Joseph Seeger
  • Patent number: 10393768
    Abstract: A method and system for a sensor system of a device is disclosed. The sensor system includes a first MEMS sensor (FMEMS), a second MEMS sensor (SMEMS) and a signal processor (SP). An excitation is imparted to the device along a first axis (FA). The FMEMS has a first primary sense axis (FPSA), moves in response to a component of the excitation along the FA aligned with the FPSA and outputs a first signal proportional to an excitation along the FPSA. The SMEMS has a second primary sense axis (SPSA), moves in response to a component of the excitation along the FA aligned with the SPSA and outputs a second signal proportional to an excitation along the SPSA. The SP combines the first signal and the second signal to output a third signal proportional to the excitation along the FA. The FA, the FPSA and the SPSA have different orientations.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: August 27, 2019
    Assignee: Invensense, Inc.
    Inventors: Matthew Julian Thompson, Joseph Seeger
  • Publication number: 20190226871
    Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Inventors: Doruk SENKAL, Joseph SEEGER
  • Publication number: 20190185317
    Abstract: A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 20, 2019
    Inventors: Jongwoo Shin, Houri Johari-Galle, Bongsang Kim, Joseph Seeger, Dongyang Kang
  • Publication number: 20190178645
    Abstract: A MEMS gyroscope includes a proof mass of a suspended spring mass system that is driven at a drive frequency. The proof mass moves relative to a sense electrode such that an overlap of the proof mass and sense electrode changes during the drive motion. A Coriolis force causes the proof mass to move relative to the sense electrode. The overlap and the movement due to the Coriolis force are sensed, and angular velocity is determined based on the magnitude of a signal generated due to a change in overlap and the Coriolis force.
    Type: Application
    Filed: September 13, 2018
    Publication date: June 13, 2019
    Inventors: Doruk Senkal, Houri Johari-Galle, Joseph Seeger
  • Publication number: 20190169018
    Abstract: A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.
    Type: Application
    Filed: May 21, 2018
    Publication date: June 6, 2019
    Applicant: InvenSense, Inc.
    Inventors: Doruk SENKAL, Yang LIN, Houri JOHARI-GALLE, Joseph SEEGER
  • Publication number: 20190144264
    Abstract: A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
    Type: Application
    Filed: November 13, 2017
    Publication date: May 16, 2019
    Applicant: InvenSense, Inc.
    Inventors: Ilya Gurin, Joseph Seeger, Matthew Thompson
  • Publication number: 20190120657
    Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 25, 2019
    Inventors: Doruk Senkal, Houri Johari-Galle, Joseph Seeger
  • Patent number: 10267650
    Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: April 23, 2019
    Assignee: InvenSense, Inc.
    Inventors: Doruk Senkal, Joseph Seeger