Patents by Inventor Joseph Seigel

Joseph Seigel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE STACKING, TESTING AND PACKAGING FOR YIELD
    Publication number: 20110057677
    Abstract: A method to test and package dies so as to increase overall yield is provided. The method includes performing a wafer test on a first die and mounting the first die on a package substrate to form a partial package, if the wafer test of the first die is successful. The method further includes performing a system test on the partial package including the first die and stacking a second die on the first die if the system test on the partial package and the first die is successful.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 10, 2011
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Bryan BLACK, Joseph Seigel