Patents by Inventor Joseph Smetana

Joseph Smetana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230300986
    Abstract: According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends.
    Type: Application
    Filed: March 13, 2023
    Publication date: September 21, 2023
    Inventors: Darrell BARABASH, Abhijit GHOSE, Joseph SMETANA
  • Patent number: 11765831
    Abstract: According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: September 19, 2023
    Assignee: NOKIA SOLUTIONS AND NETWORKS OY
    Inventors: Darrell Barabash, Abhijit Ghose, Joseph Smetana
  • Patent number: 7337537
    Abstract: A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. The via includes a plated through hole and a back-drilled hole. The plated through hole is located within a predetermined number of the stacked layers and the back-drilled hole is located within the remaining stacked layer(s). The plated through hole without an electrically conductive material located on walls therein has a diameter that is substantially the same size or smaller than the diameter of the back-drilled hole.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: March 4, 2008
    Assignee: Alcatel Lucent
    Inventor: Joseph Smetana, Jr.
  • Publication number: 20050282571
    Abstract: A communication system provides one or more of congestion information and subscriber information to a broadcast applications server when the server receives a request to start a broadcast-multicast service in a coverage area. By providing the one or more of congestion information and subscriber information to the server, the server is able to make an informed, intelligent decision concerning blocking, unblocking, downgrading, or upgrading a broadcast-multicast flow of multiple broadcast-multicast flows requested for delivery to, or currently delivered to, the coverage area via a serving base station, and/or whether to add a new broadcast-multicast flow to the broadcast-multicast flows delivered to the coverage area.
    Type: Application
    Filed: May 23, 2005
    Publication date: December 22, 2005
    Inventors: Valentin Oprescu-Surcobe, Sean Kelley, William Payne, Joseph Smetana