Patents by Inventor Joseph So

Joseph So has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10875146
    Abstract: The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: December 29, 2020
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS
    Inventors: Lee Melbourne Cook, Yuhua Tong, Joseph So, Jeffrey James Hendron, Patricia Connell
  • Publication number: 20200384603
    Abstract: The invention provides a polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The polymer-polymer composite polishing pad includes a polishing layer having a polishing surface for polishing or planarizing the substrate; a polymeric matrix forming the polishing layer and including gas-filled or liquid-filled polymeric microelements; and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a tensile strength lower than the tensile strength of the polymeric matrix wherein diamond abrasive materials cut the fluoropolymer to form a reduced number of pad debris particles in the 1 ?m to 10 ?m size range.
    Type: Application
    Filed: June 10, 2019
    Publication date: December 10, 2020
    Inventors: Nan-Rong Chiou, Joseph So, Mohammad T. Islam, Matthew R. Gadinski, Youngrae Park, George C. Jacob
  • Publication number: 20170274496
    Abstract: The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 28, 2017
    Inventors: Lee Melbourne Cook, Yuhua Tong, Joseph So, Jeffrey James Hendron, Patricia Connell
  • Patent number: 9446498
    Abstract: A chemical mechanical polishing pad is provided having a polishing layer; an endpoint detection window; subpad; and, a stack adhesive; wherein the subpad includes plurality of apertures in optical communication with the endpoint detection window; and, wherein the polishing surface of the polishing layer is adapted for polishing of a substrate.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: September 20, 2016
    Assignee: Rohm and Hass Electronic Materials CMP Holdings, Inc.
    Inventors: Joseph So, Bainian Qian, Janet Tesfai
  • Publication number: 20160263721
    Abstract: A chemical mechanical polishing pad is provided having a polishing layer; an endpoint detection window; subpad; and, a stack adhesive; wherein the subpad includes plurality of apertures in optical communication with the endpoint detection window; and, wherein the polishing surface of the polishing layer is adapted for polishing of a substrate.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 15, 2016
    Inventors: Joseph So, Bainian Qian, Janet Tesfai
  • Publication number: 20060000150
    Abstract: The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.
    Type: Application
    Filed: July 1, 2004
    Publication date: January 5, 2006
    Inventors: Francis Kelley, John Quanci, Joseph So, Hongyu Wang
  • Publication number: 20060000151
    Abstract: The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
    Type: Application
    Filed: July 1, 2004
    Publication date: January 5, 2006
    Inventors: Francis Kelley, John Quanci, Joseph So, Hongyu Wang
  • Publication number: 20050136671
    Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer at a down force pressure of at least less than 20.68 kPa, comprising by weight percent 1 to 15 oxidizer, 0.1 to 1 inhibitor for a nonferrous metal, 0.05 to 3 complexing agent for the nonferrous metal, 0.01 to 5 carboxylic acid polymer, 0.01 to 5 modified cellulose, 0.05 to 10 phosphorus-containing compound and 0 to 10 abrasive, wherein the phosphorus-containing compound increases removal of the copper.
    Type: Application
    Filed: December 22, 2003
    Publication date: June 23, 2005
    Inventors: Wendy Goldberg, Francis Kelley, John Quanci, Joseph So, Terence Thomas, Hongyu Wang
  • Publication number: 20050136670
    Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer comprising by weight percent 0.001 to 6 inhibitor for a nonferrous metal, 0.05 to 10 complexing agent for the metal, 0.01 to 25 copper removal agent for accelerating the removal of the copper, 0.5 to 40 abrasive, 0 to 10 selected from the group comprising, polyvinylpyrrolidone, thermoplastic polymer and mixtures thereof, wherein the copper removal agent is imidazole.
    Type: Application
    Filed: December 19, 2003
    Publication date: June 23, 2005
    Inventors: Joseph Ameen, Raymond Lavoie, John Quanci, Joseph So, Terence Thomas, Qianqiu Ye
  • Publication number: 20050104048
    Abstract: The present invention provides an aqueous composition useful for polishing copper on a semiconductor wafer comprising by weight percent 1 to 15 oxidizer, 0.1 to 1 inhibitor for a nonferrous metal, 0.05 to 3 complexing agent for the nonferrous metal, 0.01 to 5 carboxylic acid polymer, 0.01 to 5 modified cellulose, 0.0001 to 2 salt having a cationic and an anionic component, and balance water, the salt reducing noise level from vibration between the wafer and a polishing pad.
    Type: Application
    Filed: November 13, 2003
    Publication date: May 19, 2005
    Inventors: Terence Thomas, Joseph So