Abstract: The present disclosure relates to curable silicone elastomer compositions having enhanced adhesive properties with respect to a wide variety of substrates (hereafter referred to as “curable silicone elastomer compositions”). Elastomers made by curing the curable silicone elastomer compositions may be adhered to a wide variety of substrates to form composites comprising the elastomers and the substrates. Processes for adhering the elastomers made by curing the curable silicone elastomer compositions to the substrates are also provided. An adhesion promoter, component (D), is provided to enhance adhesion. Component (D) is a polyorganosiloxane having (i) at least one unsaturated group per molecule selected from alkenyl groups and alkynyl groups and (ii) an anhydride functionality and an aromatic functionality, wherein a carbon of the aromatic functionality is separated from a carbon of a carbonyl group of the anhydride by a carbon chain of from 1 to 3 non-aromatic carbon atoms inclusive.

Abstract: An article includes a laminate material with an aerogel layer and a polysiloxane layer distinct from the aerogel layer and in contact with the aerogel layer either directly or through an adhesive that is in direct contact with both the aerogel layer and the polysiloxane layer; where the polysiloxane layer comprises a polysiloxane and greater than 5 weight-percent and 95 weight-percent or less based on polysiloxane layer weight of fire retarding additives selected from a group consisting of metal hydroxides, mixed metal hydroxides, hydrated metal salts, and any combinations thereof dispersed throughout the polysiloxane layer.

Abstract: A composition contains filler particles dispersed in a matrix material, wherein the matrix material includes: (a) a first polyorganosiloxane that comprises an average of 2 or more succinic anhydride groups per molecule; and (b) a second polyorganosiloxane other than the first polyorganosiloxane; wherein the filler particles are present at a concentration in a range of 15 to 80 volume-percent based on composition volume and wherein the first polyorganosiloxane is present at a concentration sufficient to provide succinic anhydride groups at a concentration of 0.30 to 200 micromoles per gram of matrix material.

Abstract: A composition contains: (a) a first polyorganosiloxane; (b) 50-80 volume percent, based on composition volume, of conductive fillers; and (c) 0.1 to 2.0 weight-percent, based on composition weight, of a second polyorganosiloxane different from the first polyorganosiloxane, the second polyorganosiloxane having an average of 0.5 to 1.5 anhydride groups per molecule.

Abstract: A curable composition is disclosed. The curable composition comprises (I) an epoxide-functional silicone-acrylate polymer, (II) an aminosiloxane, and (III) a conductive filler. The epoxide-functional silicone-acrylate polymer comprises acrylate-derived monomeric units comprising siloxane moieties, epoxide-functional moieties, and optionally, hydrocarbyl moieties, and the aminosiloxane comprises an average of at least two amine functional groups per molecule. Methods of preparing the curable composition, and a cured product thereof, are also disclosed. A method of forming a composite article comprising a conductive layer with the curable composition is disclosed is also disclosed. The method comprises disposing the curable composition on a substrate, and curing the curable composition to give a conductive layer on the substrate, thereby forming the composite article.

Abstract: A method of making a eutectic alloy body by silicothermic reduction is provided. The method can include heating a mixture including silicon and a metal oxide comprising one or more metallic elements M and oxygen, forming a eutectic alloy melt from the mixture, and removing heat from the eutectic alloy melt, thereby forming the eutectic alloy body having a eutectic aggregation of a first phase comprising the silicon and a second phase being a silicide phase.

Abstract: Silicon eutectic alloy compositions and methods for making the same are disclosed. In one approach, a method may include using a glass carbon container to restrict contamination of the eutectic alloy melt. In an alternative approach, a method may include using a container having aluminum. The aluminum in the container may provide aluminum that is incorporated into the silicon eutectic alloy. Silicon eutectic bodies made by such methods are also disclosed.

Abstract: An industrial component comprising a Si eutectic alloy comprises a body having a wear surface, where both the body and the wear surface comprise a eutectic alloy including silicon, one or more metallic elements M, and a eutectic aggregation of a first phase comprising the silicon and a second phase of formula MSi2, where the second phase is a disilicide phase. The wear surface comprises a resistance to erosive wear sufficient to limit transfer of, when an abrasive product is passing thereacross, at least one of the one or more more metallic elements therefrom to the abrasive product, such that the abrasive product comprises an increase in contamination level of 200 parts per billion (ppb) or less of the at least one of the one or more metallic elements M after the passage. The body may also comprise a fracture toughness of at least about 3.2 MPa·m1/2.

Abstract: To carry out a rotational casting method of preparing a silicon eutectic alloy composition, silicon and one or more metallic elements M are melted together to form a eutectic alloy melt comprising the silicon and the one or more metallic elements M. A mold containing the eutectic alloy melt is rotated about a longitudinal axis thereof at a speed sufficient to form a rotating volume of the eutectic alloy melt in contact with an inner surface of the mold. Heat is directionally removed from the rotating volume of the eutectic alloy melt to directionally solidify the eutectic alloy melt, and a eutectic alloy composition, which includes the silicon, the one or more metallic elements M, and a eutectic aggregation of a first phase comprising the silicon and a second phase of formula MSi2, where the second phase is a disilicide phase, is formed.

Abstract: A process for producing bulk thermoelectric compositions containing nanoscale inclusions is described. The thermoelectric compositions have a higher figure of merit (ZT) than without the inclusions. The compositions are useful for power generation and in heat pumps for instance.