Patents by Inventor Joseph Steffler

Joseph Steffler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757170
    Abstract: In an embodiment, an antenna may be formed by applying an insulator to a package body and forming at least a portion of the antenna as a conductor on the insulator.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: September 12, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gareth Pryce Weale, Joseph Steffler
  • Publication number: 20210408666
    Abstract: In an embodiment, an antenna may be formed by applying an insulator to a package body and forming at least a portion of the antenna as a conductor on the insulator.
    Type: Application
    Filed: September 7, 2021
    Publication date: December 30, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gareth Pryce WEALE, Joseph STEFFLER
  • Patent number: 11139552
    Abstract: In an embodiment, an antenna may be formed by applying an insulator to a package body and forming at least a portion of the antenna as a conductor on the insulator.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: October 5, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gareth Pryce Weale, Joseph Steffler
  • Patent number: 11049792
    Abstract: A semiconductor device package includes a heatsink platform, with a ceramic isolation layer bonded to the heatsink platform. A semiconductor die may be disposed on the ceramic isolation layer, with mold material disposed on the ceramic isolation layer and surrounding at least a portion of the semiconductor die. A redistribution layer may be disposed on the semiconductor die and the mold material. Such packages, and similar, enable the use of a thin, inexpensive device substrate, while providing an efficient thermal path to the heatsink platform, while the redistribution layer enables electrical connections that are short, low-resistance, low-inductance, and low-loss connections.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: June 29, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gareth Pryce Weale, Joseph Steffler, Yik Yee Tan
  • Patent number: 10873863
    Abstract: Techniques for establishing a establishing of a high-bandwidth data connection with an aircraft using highly directional EM beam shaped transmissions are provided. In one example, a method comprises: determining a first line of sight that is unobstructed to an antenna of an aircraft, establishing a wireless data connection having a defined data transfer rate between the aircraft and the communication device using highly directional EM beam shaped transmissions along the unobstructed line of sight, transferring a defined amount of data between the aircraft and the communication device using the wireless data connection.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: December 22, 2020
    Assignee: GE AVIATION SYSTEMS LLC
    Inventors: Steven Lane Misenheimer, Joseph Steffler
  • Publication number: 20200029227
    Abstract: Techniques for establishing a establishing of a high-bandwidth data connection with an aircraft using highly directional EM beam shaped transmissions are provided. In one example, a method comprises: determining a first line of sight that is unobstructed to an antenna of an aircraft, establishing a wireless data connection having a defined data transfer rate between the aircraft and the communication device using highly directional EM beam shaped transmissions along the unobstructed line of sight, transferring a defined amount of data between the aircraft and the communication device using the wireless data connection.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 23, 2020
    Inventors: Steven Lane Misenheimer, Joseph Steffler
  • Patent number: 10455431
    Abstract: Techniques for establishing a establishing of a high-bandwidth data connection with an aircraft using highly directional EM beam shaped transmissions are provided. In one example, a method comprises: determining a first line of sight that is unobstructed to an antenna of an aircraft, establishing a wireless data connection having a defined data transfer rate between the aircraft and the communication device using highly directional EM beam shaped transmissions along the unobstructed line of sight, transferring a defined amount of data between the aircraft and the communication device using the wireless data connection.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: October 22, 2019
    Assignee: GE Aviation Systems LLC
    Inventors: Steven Lane Misenheimer, Joseph Steffler
  • Publication number: 20180343570
    Abstract: Techniques for establishing a establishing of a high-bandwidth data connection with an aircraft using highly directional EM beam shaped transmissions are provided. In one example, a method comprises: determining a first line of sight that is unobstructed to an antenna of an aircraft, establishing a wireless data connection having a defined data transfer rate between the aircraft and the communication device using highly directional EM beam shaped transmissions along the unobstructed line of sight, transferring a defined amount of data between the aircraft and the communication device using the wireless data connection.
    Type: Application
    Filed: May 23, 2017
    Publication date: November 29, 2018
    Inventors: Steven Lane Misenheimer, Joseph Steffler