Abstract: An example apparatus to prevent side load in hydraulic override pumps includes a lever rotatably mounted to a support. The apparatus includes a pump cylinder rotatable about a first end of the pump cylinder. The apparatus also includes a pump rod operatively coupled to the lever to move within the pump cylinder based on rotation of the lever. The pump cylinder rotates when the pump rod moves within the pump cylinder.

Abstract: Manual hydraulic override pumps for use with actuators are described herein. An example apparatus includes a manifold including a reservoir port to be fluidly coupled to a reservoir of fluid, a pump port to be fluidly coupled to a pump, a first actuator port to be fluidly coupled to a first chamber of an actuator, and a second actuator port to be fluidly coupled to a second chamber of the actuator. The example apparatus also includes a rotor disposed in a cavity formed in the manifold. The rotor is rotatable between a first actuating position in which the rotor fluidly couples the first actuator port and the pump port, and a second actuating position in which the rotor fluidly couples the second actuator port and the pump port.

Abstract: Manual hydraulic override pumps for use with actuators are described herein. An example apparatus includes a manifold including a reservoir port to be fluidly coupled to a reservoir of fluid, a pump port to be fluidly coupled to a pump, a first actuator port to be fluidly coupled to a first chamber of an actuator, and a second actuator port to be fluidly coupled to a second chamber of the actuator. The example apparatus also includes a rotor disposed in a cavity formed in the manifold. The rotor is rotatable between a first actuating position in which the rotor fluidly couples the first actuator port and the pump port, and a second actuating position in which the rotor fluidly couples the second actuator port and the pump port.

Abstract: Apparatus that prevent side load in hydraulic override pumps are disclosed herein. An example apparatus includes a lever rotatably mounted to a support, a pump cylinder rotatable about a first end of the pump cylinder, and a pump rod operatively coupled to the lever to move within the pump cylinder based on rotation of the lever, wherein the pump cylinder rotates when the pump rod moves within the pump cylinder.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A GGSN receives a request associated with a session creation for a mobile entity. The GGSN begins a process (a four-way handshake) for obtaining network access configuration parameters for the mobile entity and responds to the request prior to the completion of the four-way handshake. The GGSN then completes the four-way handshake. A GGSN creates an association between a first IP address and a first mobile entity and thereafter requests an IP address for a second mobile entity. In response thereto, the GGSN receives the first IP address, which the GGSN declines for the second mobile entity and reserves for the first mobile entity. The GGSN requests an IP address for the second mobile entity a second time and receives a second IP address that is different from the first IP address.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.