Abstract: A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.

Abstract: A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.

Abstract: An optical waveguide H-tree design is provided for global clock distribution on multichip modules (MCM) which has nearly zero clock skew and is useful for a distributed computer system environment. The optical waveguide H-tree design utilizes channel waveguides, curved sections and directional couplers formed using silica glass and silicon oxynitride (SiON) channel waveguide technologies. A hybrid combination of both SiON and silica glass is disclosed which has the advantages of each. The achievable clock speed is limited by the laser diode source and photodiode receiver at each chip module, and not by the optical waveguide distribution network. The high-speed optical waveguide can be configured to transmit clock signals, or for use as a multi-wavelength communication network that communicates signals to various integrated circuits (ICs) mounted on the multichip module. This is achieved using multiple laser diodes having different output wavelengths and directing their outputs into an optical multiplexer.

Abstract: A multiple quantum well arrangement which achieves significantly improved third order optical nonlinearity in a semiconductor device by way of spatially periodic electrodes applied to the semiconductor device. The spatial period of the applied electrodes and the resulting exciton confinement dimension is improved over that of previous multiple quantum well structures and to the Bohr radius range of dimensions for the semicondcutor material by way of avRIGHTS OF THE GOVERNMENTThe invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.

Abstract: The invention relates to an electric field sensor useful in detecting and measuring wideband transient electrical responses by means of an integrated optical waveguide interferometer. Mach-Zehnder devices are produced wherein one waveguide channel has been reverse poled, or has domain inversion, preferably by means of titanium diffusion into said waveguide channel. Also produced is an electrode-less optical interferometer modulator by which an optical output signal is modulated at the same frequency as an applied electric field.