Patents by Inventor Joseph Ted Dibene
Joseph Ted Dibene has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7881072Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: GrantFiled: August 11, 2006Date of Patent: February 1, 2011Assignee: Molex IncorporatedInventors: Joseph Ted Dibene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Publication number: 20100325882Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: ApplicationFiled: June 30, 2010Publication date: December 30, 2010Applicant: Molex IncorporatedInventors: Joseph Ted DiBene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Patent number: 6947293Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.Type: GrantFiled: May 16, 2002Date of Patent: September 20, 2005Assignee: Incep TechnologiesInventors: Joseph Ted DiBene, II, David H. Hartke
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Patent number: 6847529Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.Type: GrantFiled: December 20, 2001Date of Patent: January 25, 2005Assignee: INCEP Technologies, Inc.Inventors: Joseph Ted Dibene, II, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Patent number: 6741480Abstract: A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board.Type: GrantFiled: December 4, 2001Date of Patent: May 25, 2004Assignee: Incep Technologies, Inc.Inventors: David H. Hartke, Joseph Ted DiBene, II
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Patent number: 6698511Abstract: A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.Type: GrantFiled: May 17, 2002Date of Patent: March 2, 2004Assignee: Incep Technologies, Inc.Inventors: Joseph Ted DiBene, II, Farhad Raiszadeh
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Publication number: 20030214800Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.Type: ApplicationFiled: March 25, 2003Publication date: November 20, 2003Inventors: Joseph Ted Dibene, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Patent number: 6623279Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.Type: GrantFiled: April 25, 2002Date of Patent: September 23, 2003Assignee: Incep Technologies, Inc.Inventors: Edward J. Derian, Joseph Ted DiBene, II, David H. Hartke
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Publication number: 20030156400Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.Type: ApplicationFiled: March 7, 2003Publication date: August 21, 2003Inventors: Joseph Ted Dibene, David H. Hartke
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Publication number: 20030057548Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.Type: ApplicationFiled: November 8, 2002Publication date: March 27, 2003Applicant: INCEP Technologies, Inc.Inventors: David H. Hartke, Joseph Ted Dibene, Edward J. Derian, James M. Broder
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Publication number: 20030002268Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.Type: ApplicationFiled: December 20, 2001Publication date: January 2, 2003Inventors: Joseph Ted Dibene, David H. Hartke, Carl E. Hoge, Edward J. Derian
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Publication number: 20020174980Abstract: A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.Type: ApplicationFiled: May 17, 2002Publication date: November 28, 2002Applicant: INCEP Technologies, Inc.Inventors: Joseph Ted DiBene, Farhad Raiszadeh
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Publication number: 20020176229Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.Type: ApplicationFiled: April 25, 2002Publication date: November 28, 2002Applicant: INCEP Technologies, Inc.Inventors: Edward J. Derian, Joseph Ted DiBene, David H. Hartke
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Publication number: 20020172022Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.Type: ApplicationFiled: May 16, 2002Publication date: November 21, 2002Applicant: INCEP Technologies, Inc.Inventors: Joseph Ted DiBene, David H. Hartke
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Publication number: 20020151195Abstract: A method and apparatus for providing power from a first circuit board to a second circuit board is disclosed. The apparatus comprises a flex circuit having a plurality of conductive paths formed by a plurality of first conductive areas electrically coupled to a plurality of second conductive areas wherein the plurality of first conductive areas permanently and electrically coupled to a plurality of first circuit board conductive pads and the plurality of second conductive areas disconnectably and electrically coupleable to at least one second circuit board conductive pad.Type: ApplicationFiled: May 16, 2002Publication date: October 17, 2002Applicant: INCEP Technologies, Inc.Inventors: Joseph Ted DiBene, David H. Hartke
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Patent number: 6452113Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.Type: GrantFiled: February 16, 2001Date of Patent: September 17, 2002Assignee: INCEP Technologies, Inc.Inventors: Joseph Ted Dibene, II, David H. Hartke, James Hjerpe Kaskade, Carl E. Hoge
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Patent number: 6401805Abstract: An electromagnetic shielding and/or containing heatsink with venting capabilities, comprising a heatsink block, an aperture, and a thermal coupler, is disclosed. The heatsink comprises a thermally conductive material. The aperture is coupled to the heatsink block and allows a thermal carrier to pass from a first side of the heatsink block to a second side of the heatsink block. The aperture is sized to prevent at least a first electromagnetic frequency lower than a cutoff frequency from passing through the aperture. The thermal coupler is coupled to the heatsink block and couples the heatsink block to a heat source.Type: GrantFiled: December 22, 1999Date of Patent: June 11, 2002Assignee: NCR CorporationInventors: Gang Wang, P. Keith Muller, James Leo Knighten, Joseph Ted DiBene, II
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Patent number: 6356448Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.Type: GrantFiled: November 2, 1999Date of Patent: March 12, 2002Assignee: IncepTechnologies, Inc.Inventors: Joseph Ted DiBene, II, David Hartke
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Publication number: 20010038527Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.Type: ApplicationFiled: June 19, 2001Publication date: November 8, 2001Applicant: INCEP Technologies, Inc.Inventors: Joseph Ted DiBene, David Hartke
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Publication number: 20010032738Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.Type: ApplicationFiled: February 16, 2001Publication date: October 25, 2001Inventors: Joseph Ted Dibene, David Hartke, Kaskade James Hjerpe, Carl E. Hoge