Abstract: A circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Abstract: A method of connecting an optical fiber to a backplane with a right angle bend mount. The bend mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a nongripping gap between the base and the cover when the base and the cover are closed together.

Abstract: A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole. The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.

Abstract: A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole. The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.

Abstract: A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole.The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.

Abstract: A multilayer circuit board is provided with at least one signal layer, at least one feedback layer, and at least one dielectric layer positioned between the signal layer and the feedback layer. The signal layer is connected to at least one plated hole. The feedback layer has a contact pad, which is positioned adjacent to the plated hole, but is electrically isolated from the plated hole. The contact pad is connected to a measurement unit. The dielectric layer is positioned between the signal layer and the contact pad of the feedback layer. A portion of the plated hole forms a stub portion, which extends a distance away from the signal layer and typically extends a distance away from the contact pad of the feedback layer. To remove the stub portion, a hole is bored or routed into the multilayer circuit board until electrical feedback is received by the measurement unit upon contact of a portion of the boring device with the contact pad.

Abstract: A method of connecting an optical fiber to a backplane with a right angle bend mount. The bend mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: A guide insert having a guide member having an arcuate portion for bending an optical fiber of a backplane, and a circuit board assembly comprising the backplane and a daughterboard wherein the daughterboard is operatively connected to the backplane via the guide insert.

Abstract: Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with lamination to allow a simple, high tolerance insertion of through-holes is taught.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Abstract: A circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Abstract: A multilayer circuit board is provided with at least one signal layer, at least one feedback layer, and at least one dielectric layer positioned between the signal layer and the feedback layer. The signal layer is connected to at least one plated hole. The feedback layer has a contact pad, which is positioned adjacent to the plated hole, but is electrically isolated from the plated hole. The contact pad is connected to a measurement unit. The dielectric layer is positioned between the signal layer and the contact pad of the feedback layer. A portion of the plated hole forms a stub portion, which extends a distance away from the signal layer and typically extends a distance away from the contact pad of the feedback layer. To remove the stub portion, a hole is bored or routed into the multilayer circuit board until electrical feedback is received by the measurement unit upon contact of a portion of the boring device with the contact pad.

Abstract: Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with lamination to allow a simple, high tolerance insertion of through-holes is taught.

Abstract: A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and coverforms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.