Abstract: A method and apparatus for cooling a heat source is disclosed. The apparatus includes a fin-diffuser including a blower integrated with fins of a diffuser. A heat spreader is coupled to the fin-diffuser. The heat spreader is configured to spread heat from a location proximate the blower to location of the fins. The apparatus spreads heat from a heat source proximate a blower of the fin-diffuser to a location away from the blower to cool the heat source.

Abstract: An additively manufactured finned-tube heat exchanger is provided and includes only a single part. The single part includes one or more tubular elements having tubular widths of less than 0.1? and being configured to define one or more first flow paths for a first fluid and two or more fins through which the one or more tubular elements extend. The two or more fins are arranged to define second flow paths over and around the one or more tubular elements for a second fluid.

Abstract: A heat exchanger having a first core with a first end and a second end and having a first plurality of hot flow channels fluidly isolated from a first plurality of cool flow channels. The first plurality of hot flow channels and the first plurality of cool flow channels can be arranged in a first checkerboard pattern. The heat exchanger also having a first header connected to the first end of the first core, a first hot flow inlet section connected to the first plurality of hot flow channels, and a first curved portion with a first inner hot flow route that is longer than a first outer hot flow route. The first header also having a first cool flow outlet section connected to the first plurality of cool flow channels with the first cool flow outlet section being fluidly isolated from the hot flow inlet section.

Abstract: A heat exchanger includes a heat exchanger body having a first end and a second end opposed to the first end along a flow axis. A plurality of flow channels is defined in the heat exchanger body extending axially with respect to the flow axis. A first set of the flow channels forms a first flow circuit and a second set of the flow channels forms a second flow circuit that is in fluid isolation from the first flow circuit. Each flow channel is fluidly isolated from the other flow channels. The flow channels all conform to a curvilinear profile.

Abstract: A heat exchanger includes a body, a plurality of first flow channels defined in the body, and a plurality of second flow channels defined in the body, the second flow channels fluidly isolated from the first flow channels, wherein at least one of the first flow channels or the second flow channels have a changing characteristic along a direction of flow within the first flow channels or the second flow channels.

Abstract: A counter-flow heat exchanger comprising a heat exchanger core including an inner wall and an outer wall radially outward and spaced apart from the inner wall. A first flow path is defined within the inner wall and a second flow path is defined between the inner wall and the outer wall. The heat exchanger core includes a primary flow inlet, a primary flow outlet and a middle portion therebetween. The inner and outer walls are concentric at the primary flow inlet of the heat exchanger core. The inner wall defines a first set of channels extending axially from the primary flow inlet to the middle portion of the heat exchanger core diverging away from a radial center of the heat exchanger core. The inner wall and the outer wall define a second set of channels extending axially from the primary flow inlet to the middle portion of the heat exchanger core converging toward the radial center of the heat exchanger core.

Abstract: A heat exchanger includes a body made of polymer, a plurality of first flow channels defined in the body, and a plurality of second flow channels defined in the body. The second flow channels fluidly isolated from the first flow channels. The first flow channels and second flow channels are arranged in a checkerboard pattern.

Abstract: A heat exchanger includes a body, a plurality of first flow channels defined in the body; and a plurality of second flow channels defined in the body. The second flow channels are fluidly isolated from the first flow channels. The first flow channels and second flow channels are arranged in a checkerboard pattern.

Abstract: A heat exchanger includes a body and a plurality of elliptical flow channels defined in the body, the elliptical flow channels defining an elliptical cross-sectional flow area, and a plurality of non-elliptical flow channels defined in the body and interspersed between the elliptical flow channels, the non-elliptical flow channels having a non-elliptical cross-sectional flow area.

Abstract: A heat exchanger system includes an additively manufactured inlet header upstream of, and in fluid communication with, the heat exchanger core and an additively manufactured exit header downstream of, and in fluid communication with, the heat exchanger core. A method of manufacturing a header for a ducted heat exchanger system for a gas turbine engine includes additively manufacturing a header with respect to a desired airflow therethrough.

Abstract: A cooling supply package for an electronic component has a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.

Abstract: A method of cooling a component with a heat exchange device includes pulling air into a central airway in a heat exchange device using a blower; directing the air from the blower through a diffuser and across a heat sink base, wherein a first component positioned underneath the heat sink base is cooled when the air passes over the heat sink base; and directing the air out from the diffuser and across a second component to cool the second component.

Abstract: A method and apparatus for cooling a heat source is disclosed. The apparatus includes a fin-diffuser including a blower integrated with fins of a diffuser. A heat spreader is coupled to the fin-diffuser. The heat spreader is configured to spread heat from a location proximate the blower to location of the fins. The apparatus spreads heat from a heat source proximate a blower of the fin-diffuser to a location away from the blower to cool the heat source.

Abstract: An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is spaced from an outer surface of the at least one electronic component. An opening is formed through the shroud, such that air can be driven within the shroud from the blower diffuser, and across at least one electronic component, and then outwardly of the opening. A heat exchanger is positioned in the path of air leaving the opening.

Abstract: A fluid cooler packet for a plurality of electronic components has a plurality of individual cooling circuits for receiving a supply of cooling fluid from a supply header and delivering that cooling fluid to an associated electronic component. The plurality of cooling circuits each includes a return passage for receiving a return fluid after having cooled the associated electronic component, and returns the return fluid to a return header. A volume of the supply header decreases in a downstream direction as it passes over the plurality of individual cooling circuits. A volume of the return header increases as it moves in a downstream direction over the plurality of individual cooling circuits. An electronic component array is also disclosed.

Abstract: A cooling supply package for an electronic component has a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.