Abstract: A surface acoustic wave (SAW) device comprising a piezoelectric substrate having a working surface with an active zone capable of propagating an acoustic wave on said working surface; at least one interdigital transducer on the working surface, having interdigital fingers aligned in the active zone for inducing or receiving surface acoustic waves in the active zone; and a heating element on the working surface; wherein the transducer, heating element and preferably a temperature sensor are monolithically formed on the substrate.

Abstract: A surface acoustic wave (SAW) device comprising a piezoelectric substrate having a working surface with an active zone capable of propagating an acoustic wave on said working surface; at least one interdigital transducer on the working surface, having interdigital fingers aligned in the active zone for inducing or receiving surface acoustic waves in the active zone; and a heating element on the working surface; wherein the transducer, heating element and preferably a temperature sensor are monolithically formed on the substrate.

Abstract: The present invention is for a thermally controlled package for oscillators, particularly evacuated miniature surface acoustical wave oscillators (EMSO) devices. In a preferred embodiment the surface acoustical wave device is bonded directly to a heated substrate. The package is evacuated to improve temperature characteristics. A temperature heater, sensor, and control controller are utilized to maintain the internal package temperature above ambient. In one embodiment there is an additional substrate layer that house components that are not sensitive to temperature with interconnects electrically connecting the heated substrate and the additional substrates.