Abstract: An apparatus for the improved polishing or planarizing of workpiece surfaces which includes polishing pad with a plurality of self-cleaning and anti-tracking grooves along the surface of the pad. The self-cleaning grooves uniformly guide slurry and polishing debris radially outward across the surface of the pad while the anti-tracking capability acts to passively reduce the creation of localized wear zones into the polishing surface. Preferably, the grooves define a concentric pattern upon the surface of the pad and have a cross-section that is cut into a compound shape that has both a vertical and sloped surfaces. Other embodiments may include grooves with sloped parallel surfaces formed into spiral or radial patterns.

Abstract: A polishing apparatus for semiconductor wafers includes an index table with multiple wafer positions, with different surface treatment arrangements for each position. With each index motion of the table, the table is sequentially loaded and unloaded while wafers carried at the remaining stations of the index table are moved for a subsequent surface treatment step. Progress of the surface treatment at each position is monitored and, optionally, subsequent surface treatment steps may be modified to achieve a desired final condition of the substrate being processed.

Abstract: A wafer carrier includes a porous media layer through which a pressurized fluid is injected. The porous media layer introduces lateral dispersion into the pressurized flow, thereby assuring a uniform pressure at the exit surface of the porous media layer, as when the porous media layer is located adjacent the wafer being polished. Alternatively, an inflatable bladder may be introduced between the porous media layer and the wafer, again with pressure being maintained uniform by the porous media layer.

Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

Abstract: A ring extension is provided for use with a semiconductor wafer carrier. The ring extension has a radially inner surface, the lower portion of which contacts a peripheral edge of a wafer to confine the wafer during a polishing operation. A recess or groove is formed in the inner surface and a passageway extending through the ring extension provides pressure relief to prevent slurry build up.

Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

Abstract: A probe assembly is provided for semiconductor wafer polishing and similar wafer treatments. The polishing table forms a recess for receiving the probe, with the probe free end located to view interior portions of a semiconductor wafer temporarily passing over the recess. Probe data may conveniently be used for polishing end point determination.

Abstract: A laser element is mounted above a polishing pad of a workpiece polishing machine to monitor and control flatness of the pad. Actual flatness of the pad is determined by a computer processor which receives thickness measurements from the laser element and compares the thickness at the inner diameter portion of the pad with the thickness at the outer diameter portion of the pad. If the flatness varies substantially from a target flatness, a conditioning device mounted on the machine is moved appropriately relative to the pad to conform its flatness to the target flatness.

Abstract: Conditioning of a polishing pad so as to control the surface profile and achieve uniformity in wear of a polishing pad by causing the workpiece and polishing pad to oscillate radially relative to one another with the extent of the oscillating movement being sufficient so that the workpiece extends over the edges of the polishing pad.

Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: A method of fabricating a soft, resilient backing pad adapted for attachment to a pressure plate for planarizing work pieces wherein the outer exposed surface of the pad has been abraded by means of dry abrasive particles fixed on a surface of a spherical convex lapping wheel.

Abstract: An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member.

Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the upper lap plate, and a frame means supports the carriage means at spaced locations in a manner permitting the carriage means to reciprocate vertically within the frame means relative to the lower lap plate for performing abrading operations and to provide access for loading and unloading the workpieces. The upper lap plate also may reciprocate vertically and independently of and relative to the carriage means for performing abrading operations and to provide access for loading and unloading the workpieces. Additionally, the abrading machine may be provided with a temperature control device having at least one tube disposed adjacent the lower lap plate for coolant fluid flow.

Abstract: A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.

Abstract: An automated free abrasive apparatus for machining substantially similar workpieces on one side. In the apparatus a plurality of substantially similar workpieces are oriented and arranged in a lay flat configuration. Thereafter transport elements transfer the oriented laid flat workpieces to an indexing table which is movable vertically and horizontally to transport the workpieces to a machining area wherein the workpieces are machined. The orientation and machining or lapping of the workpieces is accomplished automatically without the need for an operator feeding each workpiece into the machining operation.

Abstract: A measuring bar for determining flatness and deviations therefrom comprises a rigid bar, and a plurality of support feet projecting from the bar. The support feet have free ends which occupy a common, flat plane, the free ends of each of the support feet defining a transverse supporting surface of essentially 0.005 to 0.025 inch across. Measuring devices are carried on the bar for measuring the spacing from the flat plane of at least one point on a target surface against which the support feet free ends rest, the measured point being spaced from the support feet.

Abstract: A control valve assembly for controlling the flow of abrasive slurry from a supply pump, directing a selected amount of abrasive slurry to the lapping wheel of an associated lapping machine, and recirculating the remainder of the supply of abrasive slurry to the supply pump.

Abstract: The disclosure teaches an improved manner of firmly holding a thin brittle wafer, such as a 0.01" thick silicon disc 3" in diameter, so as to allow the wafer to be brought into abrading contact with a moving lap wheel. The fixturing provides a pedestal ground flat and a pad of resilient but firm cellular material bonded on the pedestal and ground flat also. The pedestal and pad are each sized only slightly larger than the wafer to be lapped. A guide ring surrounds the pedestal and pad, leaving only a slight clearance gap therebetween, and further projects away from the pad a distance less than the thickness of the wafer as it will be after lapping. A special liquid is applied as a thin uniform film over the face of the pad, and the wafer is biased against the pad face with a uniform force sufficient to squeeze the film to near zero thickness and into the open cells or pores of the pad.

Abstract: This disclosure teaches structure for mounting a pressure plate relative to its supporting shaft in such a manner that axial forces are transmitted between the shaft and pressure plate while yet providing that the plate can freely rotate and swivel relative to the shaft even at varying angles of tilt. The mounting structure includes a pair of angular contact bearings arranged in back to back relationship, the inner races thereof being confined on the shaft and the outer races thereof being confined within a housing block. The housing block is nonrotatably keyed to the pressure plate and a single ball bearing is mounted between the pressure plate and bearing block in axial alignment with the shaft and with the pressure plate.