Patents by Inventor Joseph V. Lento
Joseph V. Lento has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8329600Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.Type: GrantFiled: July 8, 2009Date of Patent: December 11, 2012Assignee: GSI Group CorporationInventors: Bo Gu, Jonathan S. Ehrmann, Joseph V. Lento, Bruce L. Couch, Yun Fee Chu, Shepard D. Johnson
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Publication number: 20110108534Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.Type: ApplicationFiled: January 11, 2011Publication date: May 12, 2011Applicant: GSI GROUP CORPORATIONInventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Patent number: 7871903Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.Type: GrantFiled: December 22, 2009Date of Patent: January 18, 2011Assignee: GSI Group CorporationInventors: Bruce L. Couch, Jonathan S. Erhmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Publication number: 20100140239Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.Type: ApplicationFiled: December 22, 2009Publication date: June 10, 2010Applicant: GSI GROUP CORPORATIONInventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Patent number: 7666759Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.Type: GrantFiled: May 2, 2006Date of Patent: February 23, 2010Assignee: GSI Lumonics CorporationInventors: Bruce L. Couch, Jonathan S. Ehrmann, Joseph V. Lento, Shepard D. Johnson
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Publication number: 20090321396Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.Type: ApplicationFiled: July 8, 2009Publication date: December 31, 2009Applicant: GSI GROUP CORPORATIONInventors: Bo Gu, Jonathan S. Ehrmann, Joseph V. Lento, Bruce L. Couch, Yun Fee Chu, Shepard D. Johnson
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Patent number: 7563695Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.Type: GrantFiled: January 25, 2007Date of Patent: July 21, 2009Assignee: GSI Group CorporationInventors: Bo Gu, Jonathan S. Ehrmann, Joseph V. Lento, Bruce L. Couch, Yun Fee Chu, Shepard D. Johnson
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Patent number: 7538564Abstract: A laser processing system implements a method for aligning a probe element (e.g., a probe pin) with a device interface element (e.g., a contact pad of a circuit substrate). First, the laser processing system generates an optical reference beam at one or more predetermined positions to calibrate a reference field. The laser processing system then detects a position of the probe element in the reference field. The laser processing system also determines a relative position of the device interface element in the reference field. Based on the position of the probe element and the device interface element, the laser processing system then initiates alignment of the probe element and the device interface element. In one application, alignment of the probe element and the device interface element further includes contacting the probe element to the device interface element to make an electrical connection.Type: GrantFiled: October 18, 2006Date of Patent: May 26, 2009Assignee: GSI Group CorporationInventors: Jonathan S. Ehrmann, Patrick S. Duffy, Markus M. Weber, Gregg A. Metzger, Joseph V. Lento, Pierre-Yves Mabboux, Jens Zink, Yun Fee Chu
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Patent number: 7407861Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.Type: GrantFiled: May 18, 2005Date of Patent: August 5, 2008Assignee: GSI Group CorporationInventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Patent number: 7358157Abstract: A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element.Type: GrantFiled: October 6, 2005Date of Patent: April 15, 2008Assignee: GSI Group CorporationInventors: Bo Gu, Joseph V. Lento, Jonathan S. Ehrmann, Bruce L. Couch, Yun Fee Chu, Shepard D. Johnson
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Patent number: 6951995Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.Type: GrantFiled: March 26, 2003Date of Patent: October 4, 2005Assignee: GSI Lumonics Corp.Inventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson
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Publication number: 20040009618Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.Type: ApplicationFiled: March 26, 2003Publication date: January 15, 2004Inventors: Bruce L. Couch, Jonathan S. Ehrmann, Yun Fee Chu, Joseph V. Lento, Shepard D. Johnson