Patents by Inventor Joseph W. Walters

Joseph W. Walters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
    Patent number: 6767427
    Abstract: A method and apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge. The method includes providing a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge, wherein the primary edge and the secondary edge are both in contact with the polishing pad, and wherein the primary edge is generally parallel to the secondary edge. The method also includes moving the polishing pad in a forward direction, and pressing the conditioning member against the polishing pad.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: July 27, 2004
    Assignee: Lam Research Corporation
    Inventors: Joseph W. Walters, Emil Kneer, Eric Cooper, Richard Grizzard
  • Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
    Publication number: 20020185223
    Abstract: A method and apparatus for conditioning a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge. The method includes providing a non-rotatable conditioning member configured to engage the polishing pad. The conditioning member includes a primary edge opposed to a secondary edge, wherein the primary edge and the secondary edge are both in contact with the polishing pad, and wherein the primary edge is generally parallel to the secondary edge. The method also includes moving the polishing pad in a forward direction, and pressing the conditioning member against the polishing pad.
    Type: Application
    Filed: June 7, 2001
    Publication date: December 12, 2002
    Applicant: Lam Research Corporation
    Inventors: Joseph W. Walters, Emil Kneer, Eric Cooper, Richard Grizzard
  • Process control via valve position and rate of position change monitoring
    Patent number: 6265231
    Abstract: A computer implemented method for endpointing an etch process comprising the acts of monitoring an attribute of a pressure control valve and determining an endpoint of the process based upon the monitored attribute. The monitored attribute includes the position of the pressure control valve or the rate of change of the pressure control valve. The method is advantageously employed in an in-situ cleaning process of a polymerized plasma chamber.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: July 24, 2001
    Assignee: Lam Research Corporation
    Inventor: Joseph W. Walters