Abstract: A tool for disassembling a pipe or tube from a push-to-connect fitting and a method is provided. The tool includes a first body and a second body pivotally coupled to the first body. A pair of first fingers are pivotally coupled to the first body, each of the first fingers having a first semi-circular surface, the first semi-circular surfaces cooperating to engage the pipe or tube adjacent the collar. A pair of second fingers are coupled to the second body, each of the second fingers having a second semicircular surface, the second semi-circular surfaces cooperating to engage the push-to-connect fitting. Wherein with the first body is rotated from a first position to a second position, the pair of first fingers moves a fitting collar axially relative to the pipe or tube.

Abstract: A method for forming a component for a plasma processing chamber is provided. An internal mold is provided. An external mold is provided around the internal mold. The external mold is filled with a ceramic powder, wherein the ceramic powder surrounds the internal mold. The ceramic powder is sintered to form a solid part. The solid part is removed from the external mold.

Abstract: A component of a plasma processing chamber having a coating on at least one surface that comprises yttrium aluminum. The coating is an aerosol deposited coating from a powder mixture of an yttrium oxide powder and an aluminum-containing powder and having an yttrium to aluminum ratio of 4:1 to 1:4 by molar number. The coating can be annealed to form a porous ternary oxide.

Abstract: A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10?6/K. A metal oxide layer is then disposed over a surface of the component body.

Abstract: A method for forming a coating on a component of a substrate processing system includes arranging the component in a processing chamber and applying a ceramic material to form the coating on one or more surfaces of the component. The ceramic material is comprised of a mixture including a rare earth oxide and having a grain size of less than 150 nm and is applied while a temperature within the processing chamber is less than 400° C. The coating has a thickness of less than 30 ?m. A heat treatment process is performed on the coated component in a heat treatment chamber. The heat treatment process includes increasing a temperature of the heat treatment chamber from a first temperature to a second temperature that does not exceed a melting temperature of the mixture over a first period and maintaining the second temperature for a second period.

Abstract: A component of a plasma processing chamber having at least one plasma facing surface of the component comprises single crystal metal oxide material. The component can be machined from a single crystal metal oxide ingot. Suitable single crystal metal oxides include spinel, yttrium oxide, and yttrium aluminum garnet (YAG). A single crystal metal oxide can be machined to form a gas injector of a plasma processing chamber.

Abstract: An electrostatic chuck system is provided. A plate has gas apertures. A body formed by an additive process on a first side of the plate.

Abstract: An apparatus adapted for use in a plasma processing chamber is provided. An aluminum body with at least one surface is provided. An aluminum oxide containing aerosol deposition coating is disposed over the at least one surface of the aluminum body. An yttrium containing aerosol deposition coating is disposed over the aluminum oxide containing aerosol deposition coating.

Abstract: Textured silicon components of a semiconductor processing chamber having hillock-shaped or pyramid-shaped structures on its surface, and a method of texturing such silicon components. The silicon component can be selectively textured using chemical means to form the hillock-shaped structures to increase the surface area of the silicon component to improve polymer adhesion.

Abstract: A method for dynamically scheduling a data-processing workload includes recognizing minimum and maximum execution slice sizes and predicting an execution slice size for a current job of a collection of jobs. If the predicted execution slice size exceeds the maximum slice size or if the job involves date-dependent records in the future of the current date, the job is split into a working slice and a remainder slice, the remainder slice is added to the collection of jobs and the working slice is executed. Otherwise, if the predicted execution slice size is between the minimum and maximum execution slice sizes, the current job is executed.

Abstract: A temperature controller for a substrate support in a substrate processing system includes a power parameter module configured to calculate a power parameter indicative of power supplied to the substrate support. A coolant temperature parameter module configured to calculate a coolant temperature parameter indicative of a temperature of a coolant supplied to the substrate support. A heat transfer gas parameter module is configured to calculate a heat transfer gas parameter indicative of flow rates of a heat transfer gas supplied to the substrate support. A temperature calculation module is configured to calculate a temperature of the substrate support using the power parameter, the coolant temperature parameter, and the heat transfer gas parameter.

Abstract: A method for dynamically scheduling a data-processing workload includes recognizing minimum and maximum execution slice sizes and predicting an execution slice size for a current job of a collection of jobs. If the predicted execution slice size exceeds the maximum slice size or if the job involves date-dependent records in the future of the current date, the job is split into a working slice and a remainder slice, the remainder slice is added to the collection of jobs and the working slice is executed. Otherwise, if the predicted execution slice size is between the minimum and maximum execution slice sizes, the current job is executed.

Abstract: A temperature controller for a substrate support in a substrate processing system includes a power parameter module configured to calculate a power parameter indicative of power supplied to the substrate support. A coolant temperature parameter module configured to calculate a coolant temperature parameter indicative of a temperature of a coolant supplied to the substrate support. A heat transfer gas parameter module is configured to calculate a heat transfer gas parameter indicative of flow rates of a heat transfer gas supplied to the substrate support. A temperature calculation module is configured to calculate a temperature of the substrate support using the power parameter, the coolant temperature parameter, and the heat transfer gas parameter.

Abstract: Embodiments of the disclosure are materials, methods, and tools to make and break fluid loss control barriers within the perforations of a wellbore on-demand. Tools include heat emitting tools, magnetic tools, acoustic tools, gamma ray tools, and vacuum tools.

Abstract: A sand control screen assembly having a filter medium that provides a controlled offset between a shroud and the filter medium, and/or between a base pipe and the filter medium. The sand control screen assembly may also include a drainage layer positioned about the base pipe. The sand control screen assembly is utilized for preventing the flow of particulate material of a predetermined size therethrough and allowing the flow of production fluids therethrough.

Abstract: A sand control screen assembly includes a base pipe, a mesh layer, and a sand screen layer. The base pipe includes a tubular surface and a plurality of perforations formed in the surface. The mesh layer is disposed around the base pipe. Additionally, the mesh layer comprises a plurality of functionalized fibers, wherein one or more of the plurality of functionalized fibers break off from the mesh layer when impacted by one or more particulates. In some embodiments, a sand control screen assembly includes a screen layer with a functionalized coating.

Abstract: A bridge power connector includes upper and lower connector assemblies. The upper connector assembly has an upper housing holding an upper power conductor connected to a first electrical component. The lower connector assembly has a lower housing holding a lower power conductor electrically connected to a second electrical component. The upper housing is removably coupled to the lower housing using securing mechanisms to form a low-profile housing. The upper power conductor extends from a first side of the low-profile housing while the lower power conductor extends from a second side of the low-profile housing. The upper and lower power conductors extend along a mating plane of the low-profile housing. The upper power conductor is separable from the lower power conductor when the upper housing is removed from the lower housing.

Abstract: An electrical connector includes a housing having a signal contact section and a power contact section. The housing has a plurality of signal contact channels at the signal contact section and a plurality of power contact channels at the power contact section. A signal contact assembly is coupled to a rear of the housing and has a plurality of signal contacts. The signal contacts are configured to be terminated to a circuit board. A power contact assembly is coupled to the rear of the housing and has a plurality of power contacts received in corresponding power contact channels. The power contacts are terminated to ends of power wires. The power wires are configured to be electrically connected to the circuit board remote from the signal contacts.

Abstract: A bridge power connector includes upper and lower connector assemblies. The upper connector assembly has an upper housing holding an upper power conductor connected to a first electrical component. The lower connector assembly has a lower housing holding a lower power conductor electrically connected to a second electrical component. The upper housing is removably coupled to the lower housing using securing mechanisms to form a low-profile housing. The upper power conductor extends from a first side of the low-profile housing while the lower power conductor extends from a second side of the low-profile housing. The upper and lower power conductors extend along a mating plane of the low-profile housing. The upper power conductor is separable from the lower power conductor when the upper housing is removed from the lower housing.

Abstract: A sand control screen assembly includes a base pipe, a mesh layer, and a sand screen layer. The base pipe includes a tubular surface and a plurality of perforations formed in the surface. The mesh layer is disposed around the base pipe. Additionally, the mesh layer comprises a plurality of functionalized fibers, wherein one or more of the plurality of functionalized fibers break off from the mesh layer when impacted by one or more particulates. In some embodiments, a sand control screen assembly includes a screen layer with a functionalized coating.