Abstract: A method for manufacturing a semiconductor component using a sacrificial masking structure. A semiconductor device is formed from a semiconductor substrate and a layer of dielectric material is formed over the semiconductor substrate and the semiconductor device. The layer of dielectric material may be formed directly on the semiconductor substrate or spaced apart from the semiconductor substrate by an interlayer. Posts or protrusions having sidewalls are formed from the layer of dielectric material. An electrically insulating material that is preferably different from the layer of dielectric material is formed adjacent the sidewalls of the posts. The electrically insulating material is planarized and the posts are removed to form openings that may expose a portion of the semiconductor device or a portion of the interlayer material. An electrically conductive material is formed in the openings.

Abstract: A method and system of controlling a process from run-to-run for semiconductor manufacturing. The method of control utilizes a process model to establish a relationship between process control input data and process control output data. The method of control involves minimizing the difference between target process control output data and process control output data predicted by applying the process model to the new process control input data.

Abstract: Disclosed herein is a method and apparatus for monitoring the air pressure of a tire. Various colors are displayed by the apparatus to denote an inflation level of the tire, and the apparatus may remain coupled to the air nozzle of a tire indefinitely. The apparatus may include a diaphragm that deforms in response to an air pressure differential on opposing sides thereof. Deformation of the diaphragm may alter the position of a color indicating cup, such that a color is displayed through an observation window, informing a user as to the inflation state of the tire. Further provided is a method for monitoring tire pressure in high pressure tires.