Abstract: An alloyed diode is formed of a silicon wafer which is sandwiched between two pre-clad molybdenum disks. The upper molybdenum disk is clad on the side facing the silicon wafer with a thin aluminum foil and is clad on its outer surface with a nickel foil. The bottom molybdenum is clad with a solder foil of silver containing small amounts of germanium, copper and arsenic on the surface facing the silicon and is clad with nickel on its opposite surface. The three parts are stacked atop one another and placed in an alloying furnace to form a completed semiconductor wafer with solderable electrodes on opposite sides.

Abstract: A semiconductor wafer having one or more junctions is mounted on the pedestal of a threaded stud. The stud has a hexagonal outer surface and an upstanding hollow cylindrical member which forms an enclosure for the semiconductor wafer. A rigid lead having an enlarged head is placed on top of the wafer and is pressed into contact with the wafer by washer springs that are held under tension by being connected to the outer upstanding cylindrical housing of the stud. Pressure is applied from the washers through an alumina washer which is seated atop a thin mica washer. The thin mica washer ensures insulation in the event that the alumina washer is fractured. Teflon centering rings are provided for centering the molybdenum expansion electrode, the wafer and the enlarged head of the upper electrical conductor in pressure contact with the semiconductor wafer.

Abstract: First and second electrodes are formed on opposite sides of a relatively fragile, thin, flat wafer of a semi-conductor material having at least one p-n junction. The first and second terminals extend externally of the housing in which the semi-conductor wafer is enclosed. The second terminal is electrically connected to the second electrode. A flexible lead connects the first terminal to the first electrode. The flexible lead includes an elongated conductive member having at least two reentrantly bent flexible legs which have their ends spaced from one another. The flexible lead further includes an elongated lead extending perpendicular from a central region of the elongated conductive member in a direction opposite from the direction in which the flexible legs extend. The outer surfaces of the at least two legs are electrically and mechanically connected to the first electrode.