Patents by Inventor Joseph Wytman

Joseph Wytman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of processing a wafer using a compliant wafer chuck
    Patent number: 6764713
    Abstract: A method of processing a wafer includes placing a wafer atop a wafer chuck, wherein the chuck has a base and an upper body in which the upper body is coupled to the base by a flexible coupling that allows the upper body to tilt relative to the base. The wafer is engaged to a hollow sleeve and forms a floor creating an enclosed vessel to retain a processing fluid. Once the vessel is filled, the wafer is then processed utilizing the processing fluid. Further, the wafer tilts allowing for a compliant engagement of the wafer and the sleeve to prevent or reduce leakage of the processing fluid.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: July 20, 2004
    Assignee: Mattson Technology, Inc.
    Inventor: Joseph Wytman
  • Two-piece chuck
    Patent number: 6454864
    Abstract: A two-piece chuck for supporting a substrate in which a base plate allows the wafer to tilt and also exposes the underside of the wafer during wash/rinse cycle as well as during load/unload operations.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: September 24, 2002
    Assignee: CuTek Research, Inc.
    Inventor: Joseph Wytman
  • TWO-PIECE CHUCK
    Publication number: 20010036742
    Abstract: A two-piece chuck for supporting a substrate in which a base plate allows the wafer to tilt and also exposes the underside of the wafer during wash/rinse cycle as well as during load/unload operations.
    Type: Application
    Filed: June 14, 1999
    Publication date: November 1, 2001
    Inventor: JOSEPH WYTMAN
  • Compliant wafer chuck
    Publication number: 20010011637
    Abstract: A compliant wafer chuck for supporting a substrate in which an upper body of the chuck is allowed to tilt relative to the base.
    Type: Application
    Filed: April 4, 2001
    Publication date: August 9, 2001
    Inventor: Joseph Wytman
  • Compliant wafer chuck
    Patent number: 6241825
    Abstract: A compliant wafer chuck for supporting a substrate in which an upper body of the chuck is allowed to tilt relative to the base.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: June 5, 2001
    Assignee: CuTek Research Inc.
    Inventor: Joseph Wytman