Abstract: A mask for ion beam lithography is made by coating a front side, sidewalls, nd a backside of a substrate with an insulating layer; opening, on the front side of the substrate, a window in the insulating layer to expose a front substrate surface; depositing an oxide membrane on the front substrate surface; opening a portion of the insulating material on the backside of the substrate to form an exposed backside of the substrate; forming a photoresist layer on the oxide membrane; patterning the photoresist layer; ion beam etching the oxide membrane through the patterned photoresist layer to completely remove selected portions of the oxide membrane and form a stenciled pattern in the oxide membrane; removing the patterned photoresist layer from the stenciled oxide membrane; removing, from the backside of the substrate, the exposed backside of the substrate to expose a backside of the stenciled pattern in the oxide membrane, thus leaving a stenciled oxide membrane, corresponding to the stenciled oxide pattern, hel

Abstract: A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before or simultaneously with last anodic oxidation step. The treated metal according to the invention is protected even at high temperatures and under conditions of thermal cycling.

Abstract: A method for producing protecting layers on a metal selected from aluminum, titanium and zirconium, or alloys thereof, involves at least two anodic oxidation steps producing oxide layers and a thermal treatment which is carried out before the last anodic oxidation step. The treated metal according to the invention is protected even at high temperatures and under conditions of thermal cycling.

Abstract: A method is described for treating high strength metals selected from zirconium, titanium and alloyed steels, against hydrogen embrittlement. The method involves the immersion of the metal in an electrolyte solution and subjecting it to an anodic potential having a value of up to 600 volts on the hydrogen scale. According to a preferred embodiment prior to the immersion, the metal is coated with a substance possessing a low hydrogen over-potential and high affinity towards hydrogen. The method removes continuously or periodically the hydrogen from the metal by anodic oxidation and minimizes the penetration of hydrogen into the core of the metal.

Abstract: A method of obtaining a mask for X-ray lithography having a thin oxidized metal membrane supported on an annular silicon base. The method consists of the following steps: (a) deposition of a metal layer on a silicon wafer; (b) oxidation of the metal layer to form a continuous thin oxide layer; (c) etching selectively a portion of the backside of said substrate, obtaining a thin membrane of oxidized metal at the etched portion; and (d) obtaining a pattern delineation through a photoresist on said membrane framed by the silicon substrate. A most preferred deposited metal is aluminum which is converted to aluminum oxide. Then a portion of the silicon substrate is removed in order to expose the aluminum oxide membrane attached to the remaining silicon substrate. The mask prepared according to the present invention does not suffer from any distortion and preserves its accuracy even under the stresses incurred during the mask preparation and use.

Abstract: A method of obtaining a mask for X-ray lithography having a thin oxide film supported on an annular silicon base includes the following steps:(a) deposition of an oxide layer such as titania or zirconia, on a silicon or copper substrate;(b) etching selectively a portion of the backside of the substrate, obtaining a membrane on the etched portion; and(c) obtaining a pattern delineation through a photoresist on the membrane framed by the silicon or copper substrate.The mask prepared according to the present invention does not suffer from any distortion and preserves its accuracy even under the stresses incurred during the mask preparation and use.

Abstract: The present invention relates to a method for the electrodeposition of an ordered alloy structured in alternate discrete layers said alloys possessing high elastic modulus and adjustable magnetic susceptibility. According to the invention, the electrodeposition of at least two metals, characterized by a redox potential gap of at least 0.1 V between said metals, is obtained by the pulse plating technique with a frequency in the range of 0.02 Hertz to 15 Hertz. The concentrations of the noblest metal in the electrodeposition solution should be in the range of 0.001M to 2.0M while that of the less noble metal is about its saturation at room temperature. The discrete layers obtained according to the method are less than 90 Angstroms thickness, being substantially pure. Examples of the metals to be electrodeposited according to the invention are copper-nickel; copper-palladium; nickel-gold; copper-nickel-iron and corresponding alloys with cobalt or iron replacing nickel.

Abstract: A process and bath composition is described for the electroplating of palladium. The bath contains a source of palladium and thiourea or related compounds to prevent poisoning of the bath from copper ions contained on surfaces to be plated. It is particularly useful in palladium electroplating processes where foreign ions such as copper ions adversely affect the plating process. Such contamination is likely to occur where palladium is electroplated on copper or copper alloy surfaces such as are used in electrical contact devices such as switches, relays, connectors, etc. The palladium electroplating process and bath described in the disclosure yields excellent results even where extensive impurities such as copper ions have been introduced into the plating bath.

Abstract: A process for electrodepositing palladium. The article to be coated is exposed to a benzotriazole compound for preventing interference by copper ions in the plating bath. The article may be exposed either by a predip in a solution comprising a benzotriazole compound or the compound may be included in the electroplating bath.

Abstract: A process is described for treating palladium and palladium alloys so as to render them ductile and wear resistant. The process involves an electrochemical treatment which is relatively easy to carry out and is suitable for commerical use. Palladium surfaces and films treated with this process are quite suitable for a variety of applications including electrical contact applications as in switches, relays, connectors, etc.