Abstract: A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.

Abstract: A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.

Abstract: The invention discloses a simulating measurement apparatus. The simulating measurement apparatus comprises a storing module, a controlling module, and a simulating module. The storing module is used for storing simulating parameter information. The simulating parameter information comprises at least one emitting simulating parameter, at least one receiving simulating parameter, and a radio beam channel transmitting simulating parameter. The controlling module generates a controlling signal according to the simulating parameter information. The simulating module generates a simulating measurement result of radio beams transmitted in the space between an emitting antenna and a receiving antenna by simulating the transmitting behavior of a plurality of RF signals according to the controlling signal.

Abstract: The invention discloses a simulating measurement apparatus. The simulating measurement apparatus comprises a storing module, a controlling module, and a simulating module. The storing module is used for storing simulating parameter information. The simulating parameter information comprises at least one emitting simulating parameter, at least one receiving simulating parameter, and a radio beam channel transmitting simulating parameter. The controlling module generates a controlling signal according to the simulating parameter information. The simulating module generates a simulating measurement result of radio beams transmitted in the space between an emitting antenna and a receiving antenna by simulating the transmitting behavior of a plurality of RE signals according to the controlling signal.

Abstract: A coupling device with electro-magnetic compensation is provided. The coupling device includes a first substrate having a first signal line on a top surface of the first substrate and a second substrate having a second signal line on a top surface of the second substrate connected together with a bottom surface of the first substrate wherein the second signal line couples with the first signal line by a plurality of electrical-conductive through holes. One side of the first signal line lies a capacitor device parallel connected to a ground and the capacitor device plays the role of adjusting the amount of return loss, isolation capacity, and coupling effect so as to have transmitting speeds in first and second signal lines remain substantially the same and superior high frequency characteristics.

Abstract: A coupling device with electro-magnetic compensation is provided. The coupling device includes a first substrate having a first signal line on a top surface of the first substrate and a second substrate having a second signal line on a top surface of the second substrate connected together with a bottom surface of the first substrate wherein the second signal line couples with the first signal line by a plurality of electrical-conductive through holes. One side of the first signal line lies a capacitor device parallel connected to a ground and the capacitor device plays the role of adjusting the amount of return loss, isolation capacity, and coupling effect so as to have transmitting speeds in first and second signal lines remain substantially the same and superior high frequency characteristics.

Abstract: A flexible probe, applicable for measuring signals from the object with an uneven surface, includes at least a probe tip, a flexible multi-layered dielectric substrate, a planar transmission structure and a coaxial transmission structure. The probe tip is connected to the planar transmission structure and extends beyond the flexible dielectric substrate. The planar transmission structure is attached to and supported by the flexible dielectric substrate and then connected to the coaxial transmission structure.

Abstract: A flexible probe, applicable for measuring signals from the object with an uneven surface, includes at least a probe tip, a flexible multi-layered dielectric substrate, a planar transmission structure and a coaxial transmission structure. The probe tip is connected to the planar transmission structure and extends beyond the flexible dielectric substrate. The planar transmission structure is attached to and supported by the flexible dielectric substrate and then connected to the coaxial transmission structure.

Abstract: A resilient and rugged probe, used to measure an on-wafer signal. The probe has a metal probe tip, a resilient soft multi-layered dielectric substrate, a planar transmission structure and a fixed end. The probe tip is connected to the planar transmission structure. The planar transmission structure is attached to and supported by the resilient soft multi-layered dielectric substrate and then connected to the fixed end.

Abstract: A resilient and rugged probe, used to measure an on-wafer signal. The probe has a metal probe tip, a resilient soft multi-layered dielectric substrate, a planar transmission structure and a fixed end. The probe tip is connected to the planar transmission structure. The planar transmission structure is attached to and supported by the resilient soft multi-layered dielectric substrate and then connected to the fixed end.