Abstract: By means of a method, at least one component is placed on at least one substrate. The component is picked-up by at least one placement machine and is placed at a desired position on the substrate. After the component is placed on the substrate, an image of the component placed on the substrate is taken by a camera. Any difference between the actual position of the component on the substrate and a desired position of the component on the substrate is established on account of the image. The positioning of another component to be placed on the substrate takes into account any such difference.

Abstract: A component placement device includes at least two component pick and place units, which are connected to a movable frame, and at least two component feeding devices. The component placement device is suitable for simultaneously picking-up components supplied, by means of the component feeding devices by means of the component pick and place units. At least one component pick and place unit can be moved relative to the frame, which permits adjustment of the positions of the component pick and place units relative to one another.

Abstract: A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element. The first element is moved in the predetermined direction, whereas the second element is moved relative to the first element in a direction opposite to the predetermined direction and vice versa.

Abstract: A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.

Abstract: A method and device are provided for placing components in a desired position on at least one substrate. The device comprises includes a movable arm on which at least two image recording device are provided and separated by a predetermined pitch distance. In addition, two placement devices, which are separated by the same pitch distance, are also present on the arm. The spacing between the image recording devices and the placement devices is one pitch distance or a multiple thereof. A picture may be taken of at least one reference element present on a substrate by at least one image recording device, and simultaneously therewith a component may be placed on a substrate by at least one placement device.