Abstract: The invention relates to an electrical contact element, an electrical contact arrangement and methods for manufacturing an electrical contact element and for reducing oxidization of a contact section of an electrical contact element. In order to avoid that the durability of the contact element and therefore of the contact arrangement is negatively influenced by growing oxide layers on contact surfaces, the contact element is provided with a cover layer with a chemical reducing agent that can be activated by frictional forces.

Abstract: The invention relates to an electrical contact element, an electrical contact arrangement and methods for manufacturing an electrical contact element and for reducing oxidization of a contact section of an electrical contact element. In order to avoid that the durability of the contact element and therefore of the contact arrangement is negatively influenced by growing oxide layers on contact surfaces, the contact element is provided with a cover layer with a chemical reducing agent that can be activated by frictional forces.

Abstract: A method for measuring the concentration of the metal solution and reducing agent solution within the electroless plating solution is disclosed. Raman spectroscopy is used to measure the concentration of each solution within the electroless plating solution after they have been mixed together. By measuring the concentration of each solution prior to providing the solution to a plating cell, the concentration of the individual solutions can be adjusted so that the targeted concentration of each solution is achieved. Additionally, each solution can be individually analyzed using Raman spectroscopy prior to mixing with the other solutions. Based upon the Raman spectroscopy measurements of the individual solutions prior to mixing, the individual components that make up each solution can be adjusted prior to mixing so that the targeted component concentration can be achieved.

Abstract: Embodiments of the invention generally provide a method and an apparatus for treating waste effluents from substrate polishing processes, such as from an electrochemical mechanical polishing (ECMP) process. In one embodiment, a method for treating a waste effluent mixture generated during a substrate process is provided which includes flowing a waste effluent comprising chelated metal complexes from a substrate process system, combining an oxidizing agent and the waste effluent to produce free chelators, flowing the waste effluent through an organoclay media and an activated carbon media to remove the free chelators, and flowing the waste effluent through an anion exchange resin to remove metal ions and produce a waste water.

Abstract: A method for measuring the concentration of the metal solution and reducing agent solution within the electroless plating solution is disclosed. Raman spectroscopy is used to measure the concentration of each solution within the electroless plating solution after they have been mixed together. By measuring the concentration of each solution prior to providing the solution to a plating cell, the concentration of the individual solutions can be adjusted so that the targeted concentration of each solution is achieved. Additionally, each solution can be individually analyzed using Raman spectroscopy prior to mixing with the other solutions. Based upon the Raman spectroscopy measurements of the individual solutions prior to mixing, the individual components that make up each solution can be adjusted prior to mixing so that the targeted component concentration can be achieved.