Abstract: Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

Abstract: A composite formulation and electrical component are disclosed. The composite formulation includes a polymer matrix having at least 15% crystallinity and process-aid-treated copper-containing particles blended with the polymer matrix including higher aspect ratio particles and lower aspect ratio particles. The higher ratio particles and the lower ratio particles produce a decreased percolation threshold for the composite formulation when processed by extrusion or molding, the decreased percolation threshold being compared to a similar composition that fails to include the first particle and the second particles. The electrical component includes a composite product produced from the composite formulation and is selected from the group consisting of an antenna, electromagnetic interference shielding device, a connector housing, and combinations thereof.

Abstract: Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

Abstract: Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

Abstract: A method for producing a surface mount device includes providing a plurality of layers including a B-staged top layer and bottom layer, and a C-staged middle layer with an opening. A core device is inserted into the openings, and then the top and bottom layers are placed over and under, respectively, the middle layer. The layers are cured until the layers become C-staged. The core device is substantially surrounded by an oxygen-barrier material with an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.

Abstract: A method for producing a surface mount device includes providing a plurality of layers including a B-staged top layer and bottom layer, and a C-staged middle layer with an opening. A core device is inserted into the openings, and then the top and bottom layers are placed over and under, respectively, the middle layer. The layers are cured until the layers become C-staged. The core device is substantially surrounded by an oxygen-barrier material with an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.

Abstract: Embodiments of the invention generally provide a method and an apparatus for treating waste effluents from substrate polishing processes, such as from an electrochemical mechanical polishing (ECMP) process. In one embodiment, a method for treating a waste effluent mixture generated during a substrate process is provided which includes flowing a waste effluent comprising chelated metal complexes from a substrate process system, combining an oxidizing agent and the waste effluent to produce free chelators, flowing the waste effluent through an organoclay media and an activated carbon media to remove the free chelators, and flowing the waste effluent through an anion exchange resin to remove metal ions and produce a waste water.

Abstract: A method for producing a surface mount device includes providing a plurality of layers including a B-staged top layer and bottom layer, and a C-staged middle layer with an opening. A core device is inserted into the openings, and then the top and bottom layers are placed over and under, respectively, the middle layer. The layers are cured until the layers become C-staged. The core device is substantially surrounded by an oxygen-barrier material with an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.

Abstract: Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

Abstract: The present invention generally comprises a method and an apparatus for recycling electrochemical mechanical polishing (ECMP) fluid. A selected portion of used ECMP fluid may be delivered to a recycling unit where the fluid may be refurbished. The concentration of the components that are present in the selected portion of used ECMP fluid may be measured. Based upon the measurements, individual components of the ECMP fluid may be selectively dosed into the selected portion in an amount sufficient to ensure that the selected portion of used ECMP fluid, once refurbished, contains the appropriate concentration of components. Alternatively, a predetermined amount of virgin ECMP fluid may be added to the selected portion. The refurbished ECMP fluid may be recycled into an ECMP system for use in another ECMP process.

Abstract: Embodiments herein provide waste abatement apparatuses and methods for treating waste solutions derived from depleted or used plating solutions, such as from an electroless deposition process or an electrochemical plating process. The waste abatement systems and processes may be used to treat the waste solutions by lowering the concentration of, if not completely removing, metal ions or reducing agents that are dissolved within the waste solution. In one embodiment of a demetallization process, a waste solution may be exposed to a heating element (e.g., copper coil) contained within an immersion tank. In another embodiment, the waste solution may be exposed to a catalyst having high surface area (e.g., steel wool or other metallic wool) within an immersion tank. In another embodiment, the waste solution may be flowed through a removable, catalytic conduit (e.g., copper tubing) having an internal catalytic surface.

Abstract: The present invention generally comprises a method and an apparatus for recycling electrochemical mechanical polishing (ECMP) fluid. A selected portion of used ECMP fluid may be delivered to a recycling unit where the fluid may be refurbished. The concentration of the components that are present in the selected portion of used ECMP fluid may be measured. Based upon the measurements, individual components of the ECMP fluid may be selectively dosed into the selected portion in an amount sufficient to ensure that the selected portion of used ECMP fluid, once refurbished, contains the appropriate concentration of components. Alternatively, a predetermined amount of virgin ECMP fluid may be added to the selected portion. The refurbished ECMP fluid may be recycled into an ECMP system for use in another ECMP process.

Abstract: Embodiments herein provide waste abatement apparatuses and methods for treating waste solutions derived from depleted or used plating solutions, such as from an electroless deposition process or an electrochemical plating process. The waste abatement systems and processes may be used to treat the waste solutions by lowering the concentration of, if not completely removing, metal ions or reducing agents that are dissolved within the waste solution. In one embodiment of a demetallization process, a waste solution may be exposed to a heating element (e.g., copper coil) contained within an immersion tank. In another embodiment, the waste solution may be exposed to a catalyst having high surface area (e.g., steel wool or other metallic wool) within an immersion tank. In another embodiment, the waste solution may be flowed through a removable, catalytic conduit (e.g., copper tubing) having an internal catalytic surface.

Abstract: Embodiments herein provide waste abatement apparatuses and methods for treating waste solutions derived from depleted or used plating solutions, such as from an electroless deposition process or an electrochemical plating process. The waste abatement systems and processes may be used to treat the waste solutions by lowering the concentration of, if not completely removing, metal ions or reducing agents that are dissolved within the waste solution. In one embodiment of a demetallization process, a waste solution may be exposed to a heating element (e.g., copper coil) contained within an immersion tank. In another embodiment, the waste solution may be exposed to a catalyst having high surface area (e.g., steel wool or other metallic wool) within an immersion tank. In another embodiment, the waste solution may be flowed through a removable, catalytic conduit (e.g., copper tubing) having an internal catalytic surface.

Abstract: A method and system for removing heavy metals from wastewaters is provided wherein the wastewaters are pre-treated with a polymeric metal removing agent to assist in the removal of the heavy metals. The polymeric metal removing agent promotes the precipitation of large particles which may then be filtered by a high flow rate, low pressure filtration system.

Abstract: The present invention relates generally to the field of electrolytic and electroless metal plating. A method and system for determining the presence of analytes in metal plating solutions using Raman spectroscopy is described. High absorbance plating bath samples are analyzed by Raman spectroscopy by minimizing the penetration depth of the incident light beam. A chemical auto-dosing system for controlling the concentration of one or more plating bath additives in a metal plating bath is also provided.

Abstract: A method of removing arsenic and fluoride from aqueous solutions in the same process is provided. Specifically, the pH of the aqueous solution is adjusted to a pH in the range of about 5 to 8. A combination of calcium salts, and ferric or aluminum salts are added to form insoluble arsenic and fluoride bearing solids. The solids are then removed from the aqueous solution.

Abstract: A method of treating industrial wastewaters is provided. Specifically, the wastewater includes one or more organic contaminant materials and is pre-treated prior to filtering by the following steps The pH of the wastewater is adjusted to a pH in the range of about 2 to 6, and a combination of iron salts and peroxide are added to the wastewater and allowed to react for a period of at least about three minutes. Next, the pH of the wastewater is adjusted upwards to a value of at least 7 and precipitating or flocculating agents are added to form an insoluble contaminant bearing compound. The compound is then filtered from the wastewater thereby removing the contaminant materials from the wastewater. This invention is particularly suited for use with single pass flow-through filters, and most particularly suitable for high flow rate single pass flow-through filters.

Abstract: The present invention relates generally to the field of metal plating. More specifically, the present invention is related to a method and system for determining the presence of analytes in metal plating solutions using Raman spectroscopy. In an additional embodiment a chemical auto-dosing system for controlling the concentration of one or more plating bath additives in a metal plating bath is provided.

Abstract: A method for detecting and quantifying analytes such as chemical additives in metal plating bath solutions is provided. Molecular tags are incorporated into the chemical structure of the analytes of interest to affect the spectral properties of the resulting analyte-tag complexes such that they are more readily detectable in the plating bath solution by absorbance, fluorescence, or Raman spectroscopic methods.