Patents by Inventor Josh Jiang

Josh Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260074478
    Abstract: A grounding member includes a plurality of grounding terminals arranged in a row in a transverse direction and a connecting strip extending in the transverse direction and connected to one end of each of the plurality of grounding terminals. The grounding member is an integral stamped part.
    Type: Application
    Filed: September 5, 2025
    Publication date: March 12, 2026
    Applicants: Tyco Electronics Holdings (Bermuda) No. 7 Limited, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Hengkang Wu, David (Xinjie) Zhang, Josh Jiang
  • Publication number: 20260031575
    Abstract: A terminal module includes a row of terminals, each terminal having a fixing part and an elastic arm, and a welding pin connected to ends of the fixing part respectively. A holder of the terminal is integrally formed with the fixing parts of the row of terminals. A shielding assembly of the terminal includes a shielding member and an insulation member. The shielding member has a strip-shaped shielding body and multiple pairs of welding legs connected to the strip-shaped shielding body, the multiple pairs of welding legs of the shielding member are respectively welded to the elastic arms of multiple ground terminals in the row of terminals. The insulation member defines a strip and is attached to the bottom side of the strip shielding body, the insulation member is located between the elastic arms of the row of terminals and the strip-shaped shielding body.
    Type: Application
    Filed: July 24, 2025
    Publication date: January 29, 2026
    Applicants: Tyco Electronics Holdings (Bermuda) No. 7 Limited, Tyco Electronics (Shanghai) Co., Ltd., TE Connectivity Belgium BV
    Inventors: Chunming (Richard) Yu, Guangming (Suny) Zhao, Josh Jiang, Lieven Decrock, Xingjie (Steven) GE
  • Patent number: 12512625
    Abstract: An impedance matching structure for a high-speed connector includes a pair of ground leads, a differential pair of signal leads, a ground plane, a first region in which the ground leads and the differential pair of signal leads are coplanar within a first plane, and a second region in which the differential pair of signal leads lies on the first plane and the ground plane lies on a second plane extending along the first plane. The impedance matching structure has a transition region between the first region and the second region. The ground leads are connected to the ground plane in the transition region. An impedance matching projection is arranged in the transition region and projects from a side of the differential pair of signal leads.
    Type: Grant
    Filed: March 23, 2023
    Date of Patent: December 30, 2025
    Assignees: TE Connectivity Solutions GmbH, TE Connectivity Belgium BV, Tyco Electronics Holdings (Bermuda) No. 7 Limited
    Inventors: Lieven Decrock, Michael Rosier, Josh Jiang
  • Publication number: 20250131436
    Abstract: Systems and methods for enabling real-time graph machine learning models using bitwise transaction graph frameworks are disclosed. According to one embodiment, a method may include: (1) receiving, by a bitwise transaction graph computer program, a plurality of historical transactions, wherein each historical transaction comprises a customer identifier for a customer, a card number or card reference number, a merchant identifier for a merchant, a transaction authorization time, a transaction risk score, and a set of real-time fraud risk attributes; (2) converting, by the bitwise transaction graph computer program, the historical transactions to a fixed length data structure; and (3) loading, by the bitwise transaction graph computer program, the fixed length data structure onto edges of a transaction graph, wherein each vertex of the transaction graph represents one of the customers or one of the merchants.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 24, 2025
    Inventors: Yang XIANG, Fang-Yu LIN, Erica SONG, Yibin XU, Josh JIANG
  • Publication number: 20230307876
    Abstract: An impedance matching structure for a high-speed connector includes a pair of ground leads, a differential pair of signal leads, a ground plane, a first region in which the ground leads and the differential pair of signal leads are coplanar within a first plane, and a second region in which the differential pair of signal leads lies on the first plane and the ground plane lies on a second plane extending along the first plane. The impedance matching structure has a transition region between the first region and the second region. The ground leads are connected to the ground plane in the transition region. An impedance matching projection is arranged in the transition region and projects from a side of the differential pair of signal leads.
    Type: Application
    Filed: March 23, 2023
    Publication date: September 28, 2023
    Applicants: TE Connectivity Solutions GmbH, TE Connectivity Belgium BV, Tyco Electronics Holdings (Bermuda) No. 7 Limited
    Inventors: Lieven Decrock, Michael Rosier, Josh Jiang