Patents by Inventor Josh M. Bogner

Josh M. Bogner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11661532
    Abstract: Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 30, 2023
    Assignee: Avery Dennison Corporation
    Inventors: Josh M. Bogner, Dong-Tsai Hseih
  • Publication number: 20180362810
    Abstract: Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.
    Type: Application
    Filed: June 7, 2016
    Publication date: December 20, 2018
    Inventors: Josh M. BOGNER, Dong-Tsai HSEIH
  • Patent number: 9920225
    Abstract: Adhesive compositions are described which are useful for damping vibration associated with hard disk drives. The adhesive compositions include a combination of at least two partially immiscible acrylic copolymers such that the compositions exhibit at least two distinct glass transition temperatures. Also described are label assemblies utilizing such adhesives and related methods of use.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: March 20, 2018
    Assignee: Avery Dennison Corporation
    Inventors: Josh M. Bogner, Henry Milliman, Eric L. Bartholomew, Christopher L. Lester
  • Publication number: 20170233613
    Abstract: Adhesive tapes including a thin metal foil layer are described. The tapes also include a layer or one or more regions of a pressure sensitive adhesive. The tapes exhibit a high thermal conductivity and find application as heat transfer components. Also described are heat spreader assemblies using the adhesive tapes.
    Type: Application
    Filed: August 18, 2015
    Publication date: August 17, 2017
    Inventor: Josh M. BOGNER
  • Publication number: 20170121573
    Abstract: Adhesive formulations comprising expandable microspheres are described. After forming into a layer or region and expanding, the expanded adhesive layer exhibits excellent impact absorbing characteristics. The expanded adhesive layer also exhibits excellent vibration damping properties.
    Type: Application
    Filed: March 13, 2015
    Publication date: May 4, 2017
    Applicant: Avery Dennison Corporation
    Inventors: Josh M. BOGNER, Henry W. MILLIMAN
  • Publication number: 20150267088
    Abstract: Adhesive compositions are described which are useful for damping vibration associated with hard disk drives. The adhesive compositions include a combination of at least two partially immiscible acrylic copolymers such that the compositions exhibit at least two distinct glass transition temperatures. Also described are label assemblies utilizing such adhesives and related methods of use.
    Type: Application
    Filed: September 25, 2013
    Publication date: September 24, 2015
    Inventors: Josh M. Bogner, Henry Milliman, Eric L. Bartholomew, Christopher L. Lester