Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: A pressure sensor includes a substrate, a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on a first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element, thus multiple pressure sensing elements being disposed on a single substrate can reduce material cost and improve the performance of the pressure sensor.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element. The pressure sensor further includes a buffer layer disposed on the first surface of the substrate such that the first pressure sensing element is disposed on the buffer layer. Multiple pressure sensing elements disposed on a single substrate for improving the performance of the pressure sensor.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: Embodiments relate generally to methods and systems for filling a pressure sensor with a pressure transfer fluid, such as a gel, and preventing trapped air within the pressures sensor. A pressure sensor may comprise a substrate; a sense die mounted on the substrate; a housing configured to attach to the substrate over the sense die, wherein the housing comprises an opening to a hollow interior of the housing; and a gel material configured to fill the hollow interior of the housing and cover the sense die, wherein the housing comprises a plurality of shaped walls configured to direct the gel material as it fills the hollow interior of the housing.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: A flow sensor assembly that may include features that help prevent moisture from reaching a sensor die of the flow sensor assembly. In some cases, such features may include a bypass channel that is configured to reverse the direction of the flow of fluid at least once upstream of the sensor die. In some cases, an encapsulant may cover one or more bond pads of the sensor die. In some cases, an output of the flow sensor assembly may be a raw sensor output signal produced by the one or more sensor elements of the sensor die, without significant processing of the raw sensor signal.

Abstract: An automatic chamber evacuating method, system, and apparatus are disclosed, which include a nest, wherein a region or chamber, such as for example the reference chamber of an absolute pressure sensor, may be placed. A switch is used to initiate an automatic process whereby an air operated chuck seals to a tubular region protruding from the chamber via compressed air. An evacuating device connected to the tubular region by the chuck then applies a vacuum which evacuates the chamber. When the chamber has been sufficiently evacuated a message is sent to a programmable logic controller which then outputs a signal to an ultrasonic welding apparatus. The ultrasonic welder crimps and seals the tubular region thereby quickly and efficiently creating a permanent vacuum in the chamber.