Patents by Inventor Josh M. Mellinger

Josh M. Mellinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe-card interposer constructed using hexagonal modules
    Patent number: 8622752
    Abstract: Apparatus and methods for fabricating an interposer that may be used in testing a large number of electronic circuits or devices in parallel. The interposer may be fabricated from a plurality of modules that may be assembled into a selected shape, such that the assembled modules substantially fill the selected shape, e.g., a circle approximately the size of a semiconductor wafer. The plurality of modules may be formed from a single base shape (e.g., formed from a single injection mold). A portion of the formed modules may be machined into a first machined shape, or first and second machined shapes. The assembled modules may include only the base shape and first machined shape or first and second machined shapes. The limited number of shapes can reduce fabrication costs for an interposer.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: January 7, 2014
    Assignee: Teradyne, Inc.
    Inventors: Frank B. Parrish, Josh M. Mellinger
  • PROBE-CARD INTERPOSER CONSTRUCTED USING HEXAGONAL MODULES
    Publication number: 20120264320
    Abstract: Apparatus and methods for fabricating an interposer that may be used in testing a large number of electronic circuits or devices in parallel. The interposer may be fabricated from a plurality of modules that may be assembled into a selected shape, such that the assembled modules substantially fill the selected shape, e.g., a circle approximately the size of a semiconductor wafer. The plurality of modules may be formed from a single base shape (e.g., formed from a single injection mold). A portion of the formed modules may be machined into a first machined shape, or first and second machined shapes. The assembled modules may include only the base shape and first machined shape or first and second machined shapes. The limited number of shapes can reduce fabrication costs for an interposer.
    Type: Application
    Filed: April 13, 2011
    Publication date: October 18, 2012
    Applicant: Teradyne, Inc.
    Inventors: Frank B. Parrish, Josh M. Mellinger