Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.

Abstract: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.

Abstract: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. An inverted-F antenna may have first and second short circuit legs and a feed leg. The first and second short circuit legs and the feed leg may be connected to a folded antenna resonating element arm. The antenna resonating element arm and the first short circuit leg may be formed from portions of a conductive electronic device bezel. The folded antenna resonating element arm may have a bend. The bezel may have a gap that is located at the bend. Part of the folded resonating element arm may be formed from a conductive trace on a dielectric member. A spring may be used in connecting the conductive trace to the electronic device bezel portion of the antenna resonating element arm.

Abstract: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. An inverted-F antenna may have first and second short circuit legs and a feed leg. The first and second short circuit legs and the feed leg may be connected to a folded antenna resonating element arm. The antenna resonating element arm and the first short circuit leg may be formed from portions of a conductive electronic device bezel. The folded antenna resonating element arm may have a bend. The bezel may have a gap that is located at the bend. Part of the folded resonating element arm may be formed from a conductive trace on a dielectric member. A spring may be used in connecting the conductive trace to the electronic device bezel portion of the antenna resonating element arm.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.

Abstract: A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.

Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.

Abstract: A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.

Abstract: A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.