Patents by Inventor Joshi Rajeev

Joshi Rajeev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Unmolded package for a semiconductor device
    Patent number: 6740541
    Abstract: A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type device, are coupled to the substrate. Solder balls are provided adjacent to the die such that when the semiconductor device is coupled to a printed circuit board, the exposed surface of the serves as the drain connections while the solder balls serve as the source and gate connections.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: May 25, 2004
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Joshi Rajeev