Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

Abstract: Core activation and deactivation for a multi-core processor is described. In accordance with the described techniques, a processor having multiple cores operates using a first core configuration. A request to switch from the first core configuration to a second core configuration is received. Responsive to the request, a switch from the first core configuration to the second core configuration occurs by adjusting a number of active cores of the processor without rebooting.

Abstract: Systems and methods are discussed to direct an autonomous loader to a dump truck. In some embodiments, a method may include receiving dump truck geolocation data for a dump truck; receiving loader geolocation data for an autonomous loader; raising a bucket on the autonomous loader to a height; directing the autonomous loader toward the dump truck using the loader geolocation data and the dump truck geolocation data so that the bucket is positioned above a body or bed of the dump truck; and rotating the bucket downward to release a load in the bucket into the body or bed of dump truck.

Abstract: An iron-type golf club has a body that defines a rear void. The face portion includes an ideal striking location that defines the origin of a coordinate system. The body includes a central region in which ?25 mm<x<25 mm. The sole portion that is contained within the central region includes a forward sole region located adjacent to the face portion and a sole bar located rearward of the forward sole region, with the forward sole region defining a wall having a minimum forward sole thickness TFS and the sole bar defining a body having a maximum sole bar thickness TSB, such that 0.05<TFS/TSB<0.4. The sole portion includes a slot extending in a substantially heel-to-toe direction of the sole portion, the slot defining a portion of a path that extends through the sole portion and into the rear void. The slot is at least partially filled with a filler material.

Abstract: Adjustable thermal management is described. Input to adjust one or more parameters for controlling thermal conditions of a component is received. Temperature measurements of a component are obtained from two or more sensors of the component. A temperature of a thermal hotspot of the component is estimated based on the temperature measurements obtained from the two or more sensors of the component and using the adjusted parameters. Operation of the component is adjusted based on the estimated temperature of the thermal hotspot.

Abstract: Task scheduling based on component margins is described. In accordance with the described techniques, a scheduler of an operating system accesses a margin table when a request to perform tasks is received. The scheduler schedules tasks on various components of a system based on margins of those components. When a request to perform a task is received, for example, the scheduler accesses the margin table and selects a component to perform the task based on the margin information included in the margin table as well as based on the task, such as whether the task benefits more from being performed fast or being performed accurately. The scheduler then schedules the task using the selected component.

Abstract: Task allocation with chipset attached memory and additional processing unit is described. In accordance with the described techniques, a computing device includes a main system and one or more sub-systems which are coupled to the main system via a chipset link. The main system includes at least a processing unit and a system memory. The one or more sub-systems each include at least a chipset attached processing unit and a chipset attached memory. Contents of the system memory are transferable to the chipset attached memory of the sub-system via the chipset link to enable the chipset attached processing unit to perform the one or more tasks using the contents from the chipset attached memory.

Abstract: A system that includes at least a system memory, a chipset link, and a chipset attached memory is powered down. A boot-up process is loaded in the chipset attached memory. The boot-up process is performed for the system, via the chipset link, by the chipset attached memory. The boot-up process includes loading one or more memory testing applications. The system memory is tested using the one or more memory testing applications loaded by the chipset attached memory.

Abstract: Dynamic range aware conversion of sensor readings is described. A system includes one or more sensors to sense conditions of a component and output sensor readings and a system manager. The system manager is configured to convert the sensor readings into condition measurements by converting the sensor readings into the condition measurements using a first transformation while operating in a first conversion mode or converting the sensor readings into the condition measurements using a second transformation while operating in a second conversion mode. The system manager then adjusts operation of the component based on the condition measurements.

Abstract: Duplicating memory content with chipset attached memory is described. In accordance with the described techniques, contents of a system memory are duplicated on a chipset attached memory over a chipset link. Memory requests are serviced using the contents of the system memory and the contents on the chipset attached memory. Servicing the memory requests includes servicing a first portion of a read request using the contents of the system memory and a second, remaining portion of the read request using the contents on the chipset attached memory. Servicing the memory requests further includes communicating a write request to the system memory and to the chipset attached memory.

Abstract: User configurable hardware settings for overclocking is described. In accordance with the described techniques, user input to adjust hardware settings for operating a processing unit in an overclocking mode is received. The user input, for example, adjusts at least one of a voltage droop threshold or a frequency adjustment of the clock rate. A voltage droop is detected while operating the processing unit in the overclocking mode. Responsive to detecting the voltage droop, a clock rate of the processing unit is adjusted based at least in part on the adjusted hardware settings.

Abstract: Automated memory overclocking is described. In accordance with the described techniques, one or more sets of overclocked memory settings of a memory are automatically selected for performance testing and stability testing of the memory. The one or more sets of the overclocked memory settings are tested for performance of the memory and a performance indication is output for each of the one or more sets of the overclocked memory settings. The one or more sets of the overclocked memory settings are tested for stability of the memory and a stability indication is output for each of the one or more sets of the overclocked memory settings. One of the one or more sets of the overclocked memory settings are selected as optimized overclocked memory settings for the memory.

Abstract: Induced signal marginality for random number generation is described. In accordance with the described techniques, a pseudorandom number is transmitted across an interface while the interface is operated with settings configured to cause instability in the interface. A random number is received as an output of the interface. The settings configured to cause instability in the interface include overclocked settings of interface operating parameters.

Abstract: Extended training for memory is described. In accordance with the described techniques, a training request to train a memory with extended training is received. The extended training corresponds to a longer amount of time than a default training. The extended training of the memory is performed using a set of target memory settings. In one or more implementations, the extended training is performed during a boot up phase of the computing device.

Abstract: System memory training with chipset attached memory is described. In accordance with the described techniques, a request is received to train a system memory of a device. Responsive to the request, contents of the system memory are transferred to a chipset attached memory. The device is operated using the contents from the chipset attached memory. While the device is being operated using the contents from the chipset attached memory, the system memory is dynamically trained. After the training is complete, the contents are transferred back from the chipset attached memory to the trained system memory.

Abstract: Physical adjustment to system memory with chipset attached memory is described. In accordance with the described techniques, an indication for making one or more physical adjustments to system memory of a device is received. Contents of the system memory are transferred via a chipset link to a chipset attached memory. The device is operated using the contents from the chipset attached memory while the one or more physical adjustments are made to adjust the system memory. After the one or more physical adjustments, the contents are transferred back from the chipset attached memory to the adjusted system memory via the chipset link.

Abstract: Profile switching for memory overclocking is described. In accordance with the described techniques, a memory is operated according to a first memory profile. During operation of the memory according to the first memory profile, a request is received to operate the memory according to a second memory profile. Responsive to the request, operation of the memory is switched to operate according to the second memory profile without rebooting. In one or more implementations, at least one of the first memory profile or the second memory profile comprises an overclocking memory profile that configures the memory to operate in an overclocking mode. In one or more implementations, the memory is trained to operate according to the overclocking memory profile prior to operating the memory according to the first memory profile.

Abstract: Stability testing for memory overclocking is described. In accordance with the described techniques, operation of a memory with overclocked memory settings is testing during a boot up process of a computing device. Test results based on the testing are exposed via a user interface. The test results predict a stability of the memory over a subsequent time period if the memory is configured to operate with the overclocked memory settings.

Abstract: Random access memory (RAM) is attached to an input/output (I/O) controller of a chipset (e.g., on a motherboard). This chipset attached RAM is optionally used as part of a tiered storage solution with other tiers including, for example, nonvolatile memory (e.g., a solid state drive (SSD)) or a hard disk drive. The chipset attached RAM is separate from the system memory, allowing the chipset attached RAM to be used to speed up access to frequently used data stored in the tiered storage solution without reducing the amount of system memory available to an operating system running on the one or more processing units.

Abstract: Methods and apparatuses control the clock rate of a processing unit. The methods and apparatus control the clock rate by generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking. The methods include: receiving an analog voltage supply in response to detecting overclocking in the processing unit; dynamically sensing measurements of an output voltage from a voltage generator based on the received analog voltage supply; determining characteristics of a voltage droop in the output voltage based on the dynamically sensed output voltage measurements; determining a frequency adjustment for the clock rate of the processing unit based on the determined characteristics of the voltage droop; and generating an output clock rate based on the determined frequency adjustment such that the processing unit maintains the overclocking.