Abstract: A method involving the non-destructive testing of a sample electrical or electronic device is provided. The method includes measuring a power spectrum of the device and performing a Principal Component Analysis on the power spectrum, thereby to obtain a set of principal components of the power spectrum. The method further includes selecting a subset consisting of some of the principal components, and comparing the subset to stored reference data that include representations in terms of principal components of one or more reference populations of devices. Based at least partly on the comparison, the sample device is classified relative to the reference populations.

Abstract: A visualization method for screening electronic devices is provided. In accordance with the disclosed method, a probe is applied to a grid of multiple points on the circuit, and an output produced by the circuit in response to the stimulus waveform is monitored for each of multiple grid points where the probe is applied. A power spectrum analysis (PSA) produces a power spectrum amplitude, in each of one or more frequency bins, on the monitored output for each of the multiple grid points. The PSA provides a respective pixel value for each of the multiple grid points. An image is displayed, in which image portions representing the multiple grid points are displayed with the respective pixel values.

Abstract: The various technologies presented herein relate to utilizing visible light in conjunction with a thinned structure to enable characterization of operation of one or more features included in an integrated circuit (IC). Short wavelength illumination (e.g., visible light) is applied to thinned samples (e.g., ultra-thinned samples) to achieve a spatial resolution for laser voltage probing (LVP) analysis to be performed on smaller technology node silicon-on-insulator (SOI) and bulk devices. Thinning of a semiconductor material included in the IC (e.g., backside material) can be controlled such that the thinned semiconductor material has sufficient thickness to enable operation of one or more features comprising the IC during LVP investigation.